Bruce Boyes wrote:
> Tin plate is dipped in a plating tank. Soldercoat is dipping in molten
> solder. Solder is usually a much thicker layer and harder to control, so
> expect some blobs due to surface tension of the solder, I guess. Solder is
> also a tin/lead alloy whereas tin plate is presumably, well, tin.

I can certainly understand that, but I am wondering why we have never
tin plated digital SMT boards at the last three or four companies I have
worked with. One less thermal shock to the board and flatter lands, so
what is the down side? Why not ALWAYS use it over soldercoat? What am I
missing?



> Supposedly, you can start to see the effect even at 33 MHz or more on fast
> digital lines with sharp vs rounded corners. 

Thank you for responding, but I was really looking for data on round
versus chamfered.

onward thru the fog....						Jack

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