TECHNET Archives

June 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
[log in to unmask] (Frank Hinojos)
Date:
Tue, 10 Jun 1997 16:18:45 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (19 lines)
     I would like to use tented vias in my designs for the assembly 
     advantages but have heard that the tented via can then act like a 
     trash can which collects contaminants and therefore may cause 
     reliability problems.  Is this rumor founded?  Are there studies?
     
     Frank Hinojos
     Watkins-Johnson Co.

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************


ATOM RSS1 RSS2