Hi Bill-
There are a number of folks working on Pd finish reliability and
several papers have been published (see the 97'IPC Expo proceedings).
There seems to be a variety of "opinions" as to whether Pd finishes
negatively or positively impact the solder joint reliability depending
on the test data set being discussed. The Pd finishes that are
approximately 30 microinches thick or greater have shown severe
cracking problems, the Pd finishes that are approximately 8-12
microinches thick have not shown cracking problems but do have some
solderability/flux chemistry issues. I am bit confused - most of the
folks investigating Au/Pd/Ni/Cu are concerned with wirebonding
applications rather than SMT application - do you have a customer
driven issue or just exploring options? I don't know of anyone looking
at thru hole Pd finish applications.
Dave Hillman
Rockwell Collins
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______________________________ Reply Separator _________________________________
Subject: Assy: Au/Pd/Ni/Cu PCB Finish
Author: [log in to unmask] at ccmgw1
Date: 6/12/97 7:48 AM
Does anyone have experience with assembly and long term reliability of
surface mount and through hole solder joints made on PCBs coated with gold
over palladium over nickel over copper?
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