I  am also interested in PIP. AMP has one article on this ([log in to unmask]).
Please provide info.
At present we are evaluating possibility of PIP on a board with 10 layers 
and thickness of 0.162 inches. It has got SMT -chips, tantulums . The 
through holes are connectors 80 positions . The SMT parts are glued and 
soldering at wave.
The tant caps are blowing off after wave solder operation and one of 
alternate to bypass wave solder is intrusive reflow. however am having 
doubts on PIP while conn is sitting upside down. Also board being thick , 
supply of solder paste on connector (100 mil spacing staggered-that leaves 
little space for solder paste) is another big issue. solder may tend to flow 
down further on leads.
Any suggestion?

We are also separately looking at possibility of selective soldering to 
avoid direct contact of tantulum caps to wave.

My many thanks to all the respondents on Blowwing off caps ...The problem is 
still in hunting stage. shall share info once we get hold of the problem.
 ----------
From: Denis Meloche
To: [log in to unmask]
Subject: Intrusive Reflow
Date: Thursday, June 19, 1997 4:31PM

Can someone suggest a source of information on Intrusive Reflow or the Pin
in Paste process?  I have inquiries from several customers whom would like
to explore this technology and are looking for general information and
guidelines on how to set up experiments for this technique, on stencil
design, or speak with Process Engineers familiar with the technique.
Thanks,
Denis Meloche
Heraeus Inc
610-825-6050

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************