UGH! (the call phrase seems to be varying a lot in this net, so I have
to try also..)
              What do you think about waterbased fluxes vs. old standard
fluxes in the following application: sometimes we get in components
(LCC, TOs, SOTs, encapsulated processors etc) with questionable leg
finish. The electroless Gold is thin or porous, and the Nickel barrier
layer is already oxidized during the storage time of a number of monts.
In order to improve the solderability we have to pretin the legs before
SMT. Now, some say that you have to use certain waterbased fluxes to
remove oxides, others say waterbased fluxes make things even worse. Some
persons have to be the 'ass between the haystacks', and that does not
work either. Is there a black-and-white answer? / Best regards / Ingemar 

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