Reply to:   RE>Ultrasonic Cleaning

Hi Phil,

I would be concerned with Ultrasonic Cleaning of any component that
has wirebonds which are not encapsulated (with either glob top, 
moulding, etc.).

I can only relate my own experience with MQFP (Metal Quad Flat Packs).
There were some problems with MQFP several years ago when boards
were cleaned using Ultrasonic Cleaning.  The MQFP (aka MQUAD) is
an aluminum package where the wirebonds are not encapsulated.

This should not be a problem with BGA unless there are BGA's which
have un-encapsulated wirebonds.  This may be the case with
the Metal BGA (MBGA which was developed by Olin, who also developed
MQFP). 

Hope this helps.

Charles Elliott
NPI Process Engineering
Newbridge Networks
[log in to unmask]

--------------------------------------
Date: 1997.06.06 2:59 PM
To: Charles Elliott
From: [log in to unmask]
I have a argument going on ultrasonic cleaning of PWA's with different types
of component.

Several opinions have come up: 
(1) Never ultrasonic clean if you have hybrids with wire bond connections.
(2) Hybrids are OK to clean in an ultrasonic if an encapsulant is used.
(3) Hybrids are OK to clean if they supplier follows standard wire bond
requirements.
(4) Do any of the above rules apply to multichip modules.
(5) Do Ball Grid Array fall in any of the above categorties.

Phil Hinton 
[log in to unmask]    

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