Hello,
     
        I am interested in testing solderability of printed circuit boards. 
     There are 5 techniques mentioned in ANSI/J-STD-003 "Solderability 
     Tests for Printed Boards". They are : Edge dip, rotary dip , float, 
     wave, and wetting balance. The first three are done in a solder pot. 
     There is another method called "SERA Testing" that is not mentioned.
        Do any of these prove reliable in predicting a boards performance 
     during assembly? Is it better to age the samples before testing? If so 
     then is steam aging the best method?
        Interpretation of results seems to have a certain amount of 
     latitude. Is there a comprehensive authoritative work on the subject.
        Some of the contacts for equipment manufactures mentioned in 
     section 6 of the document mentioned above are no longer valid. Are 
     there still sources for this equipment?
        There is no source for wave solder testing equipment listed. Is 
     there a lab scale unit available?
        I am interested in presenting a paper in September at the IPC 
     Summit on PWB Surface Finishes and Solderability  in September titled 
     something like "Survey of Solderability Testing Techniques". I plan on 
     using information gathered on TECHNET in this paper. If you have 
     information and wish to assist please contact me.
     Thanks
     Rich
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     Richard Olsen                Telephone (602)-232-9154 
     Continental Circuits Corp.   Main      (602)-268-3461 
     3502 East Roeser Road        Fax       (602)-268-0208 
     Phoenix Arizona              Pager     (602)-310-6245
     85040-2905                   Internet  [log in to unmask] 
     USA                    I make circuit boards,what do you do?
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