>What I am wondering is three things..

>1. Should it be necessary to bake teflon immediately prior to HAL?

Only if you have some sort of warpage issue (no moisture absorbtion).

3. From a design/reliability standpoint, would leaving only a tin plated
>finish over the copper antenna be a problem.

I've seen several boards with unfused tin/lead on then per customer request.
They were used this way but considering the crumbly nature of tin,
tin/lead I wouldn't like to do this unless the customer was confident.

Thomas E. Waznis

Halllmark Circuits Inc.

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