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Subject:	Re: LPISM STRIPPING
From:	Lenny Kurup <[log in to unmask]>
Date:	Mon, 16 Jun 1997 11:52:08 -0400 (EDT)
Content-Type:	TEXT/PLAIN
Parts/Attachments:	TEXT/PLAIN (47 lines)

On Mon, 16 Jun 1997, Lenny Kurup wrote:

> To: Last few em, concerning the stripping of lpism after thermal curing.
> 
> 
> Epoxy based lpism are practically impossible to strip and it is my
> recommendation that you not attempt to strip these boards. The main problem
> is attack of the butter layer by the solvent in the stripping chemistry and
> the heat effect. 
> 
> Aqueous lpism can be stripped by a proprietary chemistry (RBP-CHEMELEX
> solder mask remover), within 3 hours at about 130 F. The butter layer is
> not attacked by any harsh solvents and the immersion time is greatly
> reduced from the 48 hours, previously described, hence the heat effect is
> greatly reduced.
> 
> 
> Good Luck,
> 
> Lenny Kurup
> [log in to unmask]   (for more details)
> 
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