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June 1997

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Subject:
From:
Jim Herard <[log in to unmask]>
Date:
Wed, 18 Jun 1997 16:12:27 -0400
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Tin Bismuth and Indium Tin have both been used.  IBM uses Tin Bismuth
extensively.

Jim Herard
KBL, Product Quality Engineering
IBM Microelectronics Endicott
t/l 857-7026

---------------------- Forwarded by Jim Herard/Endicott/IBM on 06-18-97 04:08 PM
 ---------------------------

        [log in to unmask]
        06-18-97 02:33 PM
Please respond to [log in to unmask] @ internet

To: [log in to unmask] @ internet
cc:
Subject: Alternative solder alloy for a special process application


Does anyone know a alternative solder alloy with lower melting point (160C
- 175C) than that of 63Sn37PB (183C). I'm looking for an alternative that
is already used in the industry (reliable, usable with no clean flux and
easy to dispense)?

Has the 49.75Sn/41.75PB/8Bi/0.5Ag alloy been manufactured yet and used in
the industry? I read a paper describing the benefits of that solder type
and it was very promising. It was published in Circuits Assembly (I don't
have the date nor the volume number).

Thanks in advance
-------------------------------------------------
Patrick Ducas
Process Quality Engineer
Matrox Electronic Systems Ltd
E-mail: [log in to unmask]
T‚l:(514)969-6000 ext.2971   Fax:(514)685-3415
-------------------------------------------------


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