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June 1997

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From:
"ddsulliv" <[log in to unmask]>
Date:
Mon, 30 Jun 97 09:20:11 cst
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          Tony,
          
          I agree with Mark.  DuPonte published a paper in, I Believe, 
          PC Fab several years back detailing supersaturation of air 
          in plating baths where the circulation pump intake was too 
          high up in the plating bath and was sucking in air from the 
          air sparge system.  The air was then compressed by the 
          pumping system and ended up as very fine bubbles which 
          attached to the panels being plated right along the 
          photoresist/copper boundary.  These fine bubbles inhibited 
          plating where they attached, causing mousebites.
          
          The trick to avoiding this was to move the intake to the 
          circulation system to a place where air from the sparge 
          system is not present.  I had one shop that actually set up 
          a separate tank with an overflow weir to accomplish this.  
          The mousebite did go away.
          
          Mark is right that you may have a leak in your filter which 
          allows air to get into the circulation lines as well.
          
          One other area you might check is the water rinses after 
          developing.  These should be cleaned periodically because 
          resist residues can build up there.  Also, make sure you 
          have plenty of water flow through these rinses to assure 
          good rinsing of developer solution from your product.  
          
          I have found that mousebites are not just caused by one area 
          (developing, plating) but by a combination of factors.  
          Unfortunately, it sounds like you have a situation where 
          your plating and resist suppliers aren't cooperating to 
          solve your problem.  They're just pointing fingers (a not 
          uncommon situation).
          
          Regards,
          
          Dave Sullivan
          Rockwell Collins, Inc.
          
          [log in to unmask]


______________________________ Reply Separator _________________________________
Subject: Re: [Fwd: Mousebites/divots]
Author:  [log in to unmask] at ccmgw1
Date:    6/27/97 4:47 PM


Tony,
          
I'm not sure your problem is from super saturation in your plating tanks, but 
it could be.  The defect usually looks like a circular pit or depression in 
the copper trace or pad.  It is almost always on one side of the trace, 
although I have seen it in the middle in sever cases.  
          
There are two typical causes of air saturation.  One:  if you have a solution 
filtration system that has the intake located close to an air sparger tube.
 As the solution is sucked into the filtration system, it pulls air bubbles
in from the tank.  These bubbles are compressed under pressure in the pump, 
and the solution becomes loaded with air.  Since this appears to be a recent 
phenomenon, this is probably not the cause.
          
Two:  Your filter pump has developed a small leak, and is sucking air as it 
pumps.  The result is the same as above.  I would start checking here.
          
There is a simple way to determine if you have an air saturation problem.
 Turn off your air spargers for 24 to 48 hours (over the weekend, for
example).   This will give the bath a chance to stabilize, and any air in 
solution to come out.  When you start up the tank on Monday morning, see if 
you still have pits on the first load.  If you don't, then you probably have 
a saturation problem.  If you do, look at some other area of the process. 
          
Since you've recently done some carbon treating, you may want to have your 
copper vendor run tests on the tanks.  CVS and hull cell tests should help 
you identify any problems there.
          
Your dryfilm process sounds pretty good.  I doubt HG is causing the pits.
 Contact me if I can be of help.
          
Mark Dowding
Regional Technical Specialist
Insulectro
909-943-5758
          
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