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TECHNET Archives


1995


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Table of Contents:

"CE" standard for Europe (3 messages)
"GLASTIC" AND PALLET BOARD MATERIAL (2 messages)
"GLASTIC" INFO REQ (2 messages)
"Unwanted" metal on PWB after etch (2 messages)
(Fwd) Re: Nonfunctional Lands (1 message)
(Fwd) TechNet Information (2 messages)
(no subject) (1 message)
(U) Electroless Ni/Au Self-life (1 message)
(U) IEC 950 standards (1 message)
...no subject... (1 message)
0.020" pitch SMT pad widths (2 messages)
1/4 oz cu (2 messages)
55110 to IPC-RB-276 (1 message)
6:30 PM IPC Designers Council Chesapeake Chapter Meeting (1 message)
7628 M/L Lay-up (1 message)
90Pb-10Sn Solder (1 message)
? (2 messages)
About TDR coupons (1 message)
Accelerated aging of solder (3 messages)
Acceptance Standards (2 messages)
address for Laura Turbini (3 messages)
ADHESIVE DISPENSERS (2 messages)
Air entrapment in pastes (1 message)
Alternative to electroless copper (2 messages)
ALUMINUM COATED PCB (2 messages)
Anode baskets for Acid Copper plating (4 messages)
ANSI Standards (2 messages)
Apology (2 messages)
Append To TechNet By AT&T (1 message)
Aramid Base Materials (2 messages)
Assembly FAQ's (1 message)
ASTM Standards (1 message)
automatic printers (1 message)
available forums and bulletin boards (1 message)
available used CNC Driller / Routers (1 message)
Back heating (1 message)
Backpanel (1 message)
BAKE TIME (2 messages)
BAKE TIME (fwd) (2 messages)
Baking of Boards (1 message)
Ball Grid Array (1 message)
Ball Grid Array Vibration Reliability (1 message)
Ball Grid Arrey (1 message)
Base material shortages (1 message)
Bellcore - connector lubricants (1 message)
benchmark/salary (1 message)
BGA & CGA Licensing (1 message)
BGA Information (1 message)
BGA Rework (2 messages)
BGA TECHNOLOGY (1 message)
BGA Test Manf. Samples (1 message)
BGA X-ray video (1 message)
Blind vias (3 messages)
Board House Referrals (3 messages)
Buried Resistors and their tolere (3 messages)
Burp Cycle! (7 messages)
C4 DIE ATTACH (1 message)
Cable and Mechanical Workmanship Standards (5 messages)
Cable requirements (1 message)
cad artwork output (1 message)
Calculating Annular Ring (2 messages)
Call for Papers (1 message)
Calling all Salesmen NO (1 message)
Camera - High Magnification (2 messages)
Cancelled mil specs... reac (3 messages)
CAPACITOR SIZE (2 messages)
capacitor soldering (4 messages)
CATCH-666 (1 message)
Ceramic Capacitor Stress Cracking (1 message)
Ceramic Passives on FR4 (1 message)
CFC Cleaning Alternatives (1 message)
CFP: European Surface Mount Conference (1 message)
Chapter and verse on welded repairs to PWB outers. (1 message)
Chesapeake Chapter IPC Meeting (1 message)
Chesapeake IPC Directions (1 message)
chip-scale attachement (4 messages)
Circuit Board Newsgroup - alt.electronics.manufacture (2 messages)
Circuit Board Newsgroup - alt.electronics.manufacture.circuitboa (2 messages)
Circuit Repair (7 messages)
CircuiTree info (1 message)
CircuiTree info. (1 message)
CircuitWorld Web Site (1 message)
Clarification ; Solder balls (3 messages)
Clean Rooms (1 message)
Cleaning of Roger's Duriod 6002/6010 Material (4 messages)
Cleaning PCBd's prior to Conformal Coat (1 message)
Cleaning Rogers Duriod (1 message)
Cleaning Survey Results 91-94 (1 message)
CLEANLINESS CORRELATION (2 messages)
Cleanliness testing with Omegameter as a contract manufa (1 message)
Cleanliness testing with Omegameter as a contract manufacturer (2 messages)
Component lead attachment (2 messages)
Component Lead Tinning (5 messages)
Component outgassing (1 message)
Component Shortage (1 message)
COMPONENT TRENDS (4 messages)
Component Trends; Re: (1 message)
conductive adhesives (5 messages)
conductive adhesives??? (2 messages)
Conductive Epoxy (3 messages)
Conductor Peel Strength -- Teflon PWB's (2 messages)
Conductor Width (1 message)
Conductor Width Measurement (5 messages)
conferences (2 messages)
conferences (fwd) (1 message)
Conformal coat PC-101 (2 messages)
CONNECTOR LUBRICATION METHODS (4 messages)
Connector Placement (1 message)
Consultant wanted (5 messages)
CONSULTANTS NEEDED or WANTED (1 message)
CONSULTANTS NEEDED or WANTED - - to robt willis (1 message)
CONSULTANTS WANTED (1 message)
Contacts Needed (3 messages)
Controlled Impedance (7 messages)
Controlled Impedence-Teflon (3 messages)
Convert from P-55110 (1 message)
Copper Core PWB Assembly (1 message)
Copper Core PWB Assembly (fwd) (1 message)
Copper Cored PWA Assembly (1 message)
Copper thickness Gauges (1 message)
Copper thickness instrument (1 message)
copper-at-edge (5 messages)
Copy of: Solder Resist Cure Test (3 messages)
cost of OPC vs HASL (1 message)
cost of OSP vs HASL PWB coating (4 messages)
Cracked MLC capacitors. (1 message)
Cracking Capacitors (2 messages)
Cracking of Type XR7 Multilayer Capacitors (1 message)
Cracking of X7R capacitors. (1 message)
Cracking X7R capacitors (2 messages)
Crop marks (2 messages)
CSA, and European Safety requirements (2 messages)
CTE Values for PWB (1 message)
CTE Values of Printed Circuit Board and Heatsink combina (1 message)
CTE Values of Printed Circuit Board and Heatsink combinations (1 message)
Current Carrying Capacity of traces and vias (2 messages)
Current Revs of some IPC Docs (2 messages)
DATE CODES (6 messages)
Defluxing complex electroni (1 message)
Defluxing Electronic Assemblies (1 message)
delamination (4 messages)
Delamination/baking boards (5 messages)
Delamination/response (3 messages)
dendritic growth (1 message)
Dendritic Growth? (7 messages)
Design & Documentation Trouble-Shooting (1 message)
designed line width/spacing vs finished board. (2 messages)
Dielectric Breakdown BTW Conductors (1 message)
Dielectric Constant variation (3 messages)
difficult soldering on OPC bare copper boards (5 messages)
DIL component conversion to a surface mount leadform (3 messages)
dimensional stability (4 messages)
Direct connection of vias to Gnd (2 messages)
Does Spec Exist? (1 message)
Does this spec exsist? (2 messages)
Double Treated Copper vs. Standard (Not Black) Oxide(s) (1 message)
DRC (3 messages)
DRC, Netlist Testing, ... (1 message)
E-mail address for Laura Turbini (1 message)
Electroless Ni (2 messages)
Electroless Ni/Au Self-life (1 message)
Electroless plating (1 message)
EMPLOYMENT OPPORTUNITIES (3 messages)
Employment Opportunity (5 messages)
encapsulant process (2 messages)
Enthone DSR 3241 Solder Mask (3 messages)
EOS/ESD Failure Analysis (1 message)
EPA RELEASES HWIR PROPOSAL (1 message)
Epoxy Hard Cap Process (1 message)
ESD functional test standards (1 message)
ESD protection ... (fwd) (1 message)
ESD Protection requirements (3 messages)
Etchback (3 messages)
European "CE" Markings (2 messages)
Exacta Circuits / laminates (2 messages)
Excessive curing (1 message)
EXCESSIVE CURING OF SOLDER MASK OVER FR4 (3 messages)
EXPOSE COPPER (1 message)
Facility tour, Los Angles area, 4 Oct 95, electronic packaging (1 message)
Feeds and speeds (1 message)
Film Area Calculator NO (1 message)
FINAL CLEAN (1 message)
final clean equipment after rout (1 message)
Fine pitch and re-reflow (1 message)
Fine Pitch SMT mods (8 messages)
Flex Circuit Specs (4 messages)
Flex Processing Frame (2 messages)
Flexible circuit laminate types. (2 messages)
FLUX & SOLDER PASTE QPL (2 messages)
Flux Amount (4 messages)
Foil Lamination (4 messages)
Foil vs Component Lam. (2 messages)
FR-4 vs FR-5 (1 message)
FR2/CEM1 laminate properties (2 messages)
FR4 versus FR5 (3 messages)
Fungus Test (2 messages)
FW: (2 messages)
FW: BGA Test Manf. Samples (1 message)
FW: Ni contamination (1 message)
FW: Soldering to Gold (2 messages)
FW: Windows, Windows and more Windows (1 message)
fwd: Board House Referrals (1 message)
Fwd: Cencorp 540 PCB Depaneling Shear Wanted ! ! (1 message)
fwd: IPC & MIL-STD specs (1 message)
fwd: IPC & MIL-STD specs (fwd) (1 message)
Fwd: plated thru hole rim voids (1 message)
Fwd: Re: Other email forums? (1 message)
Fwd: Returned mail (1 message)
Fwd: Rework Wire Attachment (1 message)
FWD: Solder balls.... (1 message)
Fwd: Vias in SMT pads (1 message)
Fwd:re: Re: Etchback (1 message)
FWD>RE>Defluxing complex el (1 message)
General PCB Discussions (1 message)
General Questions (3 messages)
GETEK (1 message)
GETEK Material (1 message)
Gold coating of SMT pads (1 message)
Gold Flash Coating (5 messages)
Gold Solder (1 message)
Gold Thickness Requirements for Tabs (3 messages)
Gold Wire Bonding (1 message)
HALOGEN/ANTIMONY-FREE COPPER LAMINATE (2 messages)
Handling OSP coated PCB's.... (2 messages)
HASL thickness and scoring (3 messages)
HASL vs. Hot Oil Reflow (1 message)
HASL/plate with Sn-Pb-Bi (1 message)
Heat Dissapation (1 message)
Help on DIN hardware! (1 message)
Hiding component identification (2 messages)
High Frecuency PCB (1 message)
High Frequency PCB (1 message)
High temperature flux (1 message)
High Z Axis Expansion Board Materials (6 messages)
Hole to board edge (9 messages)
Hole to board edge -Reply (1 message)
Housekeeping/Environment Requirements for PWB Fab (1 message)
How do we compare? (3 messages)
http://www.automata.com/ipc/technet1/msg00724.html (1 message)
Humidity/Temp Monitor for IC Dry Storage (2 messages)
Ideas for alloys for use in switch contact (1 message)
ILLINOIS DESIGNERS COUNCIL (1 message)
Immersion gold (1 message)
Impedance test system (1 message)
Importance of Drying (4 messages)
In-Line X-Ray Inspection Systems for Sol (1 message)
Industry Pricing Trends (2 messages)
Information (1 message)
Information request (3 messages)
Insp. of Low Residue Hd. So (1 message)
Intergraph and Massteck PCB Layout Editor (1 message)
Interleaves and cleanroom NO (2 messages)
Internal HTE Copper Foil (2 messages)
Internal Registration (2 messages)
International Glass Suppliers/Weavers (1 message)
Internet Access Address for EMPF (1 message)
Internet Access Address for EMPF (fwd) (1 message)
Interrupted forum services (1 message)
Invisible Sender's Address (2 messages)
Ionics and Adhesives (1 message)
Ionics in adhesives/circuits (fwd) (2 messages)
IPC & MIL-STD specs (6 messages)
IPC & MIL-STD specs (fwd) (1 message)
IPC 610 Posters (1 message)
IPC 610 QUESTION (3 messages)
IPC Ball Grid Array Symposium (1 message)
IPC Design Guide (2 messages)
IPC Designers Conference and Exhibition (1 message)
IPC Designers Council Chesapeake Chapter Meeting (1 message)
IPC Designers Council Chesapeake Chapter Meeting Schedule (1 message)
IPC Documents (2 messages)
IPC Fall meeting - Important Sessions! (1 message)
IPC Gold Spec (2 messages)
IPC on the WWW (1 message)
IPC Printed Circuits Expo (1 message)
IPC SPECS (2 messages)
IPC STANDARDS (5 messages)
IPC versus Mil-specs (3 messages)
IPC-A-600 (2 messages)
IPC-A-610 vs ANSI/J-STD-001 (3 messages)
ipc-d-319 (fwd) (2 messages)
IPC-EM-782 (1 message)
IPC-SM-782 (2 messages)
IPC-SM-782 1210 FOOTPRINTS (4 messages)
IR microscopy need (1 message)
JIPC/ITRI Technology Exchange Meeting (1 message)
job offered (1 message)
JOB OPENING - ENGINEERING MGMT. (1 message)
Job opening: Business Development Manager / Alpha Metals (1 message)
JOB OPENINGS (1 message)
Job Opportunities Available (1 message)
Job Opportunity (1 message)
JOB OPPORTUNITY AVAILABLE (2 messages)
Job Opportunity for Engineers (1 message)
JOB OPPORUTNITY AVAILABLE (1 message)
Job Posting (3 messages)
Job Posting (Not a vote) (1 message)
JOB POSTING DIRECTOR OF SALES & MARKETING (1 message)
Job Postings (9 messages)
Job Postings - PCB Assembly Engineers (1 message)
job postings discussion (1 message)
June Program, Los Angles area, electronic packaging (1 message)
Know any good process engineers in search of challenge? (2 messages)
LAMINATE DIMENSIONAL TESTING (2 messages)
LAMINATE HISTORY (1 message)
laminate with CTI of 400+ (5 messages)
laminate with CTI of 400+.....(resent) (1 message)
Laminates and Prepregs (5 messages)
Lamination pinning (2 messages)
Laser drilling of vias (3 messages)
Laser Drilling of vias, posted June 13th (1 message)
Legend Ink (1 message)
Legend Screen (1 message)
LONG ISLAND (NY)... DESIGNERS COUNCIL FORMING (1 message)
Looking for Information on bare board re-working (1 message)
Looking for Work (2 messages)
Lot Coding PCBs (1 message)
lotcoding PCB's (2 messages)
LPI Soldermask with Tented Via's (5 messages)
MACHINE SHOP CLEANING (2 messages)
Manufacturer's Locator Matrix (2 messages)
Manufacturer's Locator Matrix Inquiry. (4 messages)
Manufactures Locator Matrix (2 messages)
MARKET SHORTAGES OF LAMINATES AND PREPREGS (1 message)
Masking during Reflow (2 messages)
Mass Lead Trimmers (2 messages)
Max Operating Temperature (2 messages)
MCM-L Documentation (4 messages)
Mecseal finish and assemblyproblem (3 messages)
Message for William Waerhouse, Larry Rehder,Sarah Leach,Brian O'brien & Steve Gregory (1 message)
Mexican Board Shops (1 message)
Mil Standard Replacements (3 messages)
MIL-I-46058C Coat. Adh. Cou (1 message)
Mil-P-13949 (1 message)
Mil-P-13949F (3 messages)
MIL-S-13949H TYPE CF Material (1 message)
Military rigid flex (1 message)
Minimum Solder Thickness @ Assembly (6 messages)
Minumum Nickel Plating Thickness (1 message)
Missing Components (1 message)
Mitsubishi Bond Film (1 message)
More information (1 message)
MULTI-LAYER LAY-UP MATERIAL VERIFICATION (1 message)
Multibus II Backpanels (2 messages)
Murata Erie Changes (4 messages)
Net List Testing (1 message)
New 1507 type glass fabric (1 message)
New BGA Via Soldering (2 messages)
New British Surface Solderability Test Method (2 messages)
New Revisions of RF-276 (1 message)
New Revisions of RF-276 and A-600 (3 messages)
New SMART Group Cleraning Survey (1 message)
New web site and newsgroup (1 message)
Ni contamination (3 messages)
Ni contamination (fwd) (1 message)
Nickel Diffusion Barrier (3 messages)
No Clean (1 message)
No clean process impacts (fwd) (1 message)
NO SUBJECT (3 messages)
No-clean Process Controls (4 messages)
No-clean process impact (2 messages)
Non solderable toes on QFP's (2 messages)
non-functional (1 message)
Non-functional pad removal (2 messages)
Non-Functional PadMy View-- non-functional pads (4 messages)
non-functional pads (2 messages)
Non-functional Pads. (1 message)
Non-Functional Pads? (5 messages)
Non-Plated hole to Etched feature locational tolerance (2 messages)
None (1 message)
Nonfunctional Lands (5 messages)
OEM DFM COnference (2 messages)
Offshore procurement of PWB (3 messages)
open dialog (1 message)
OPTALLOY SOURCE (1 message)
Optical Comparators (2 messages)
OSP (entek) and Press Fit Connectors (3 messages)
OSP on teflon boards (1 message)
OSP VS Immersion gold VS HASL (3 messages)
Outer circuit & PISM registration. (1 message)
Package Type Standards (1 message)
PAL Programing Requirement (1 message)
Palladium for PCB (2 messages)
Palladium Lead Plating Problems (2 messages)
Palladium plated IC leads. (5 messages)
Panel Polishing (1 message)
Parallel Communications Through Status Lines. (1 message)
Paste in hole (3 messages)
Pb migration on thick film ceramic (4 messages)
pcb flatness (2 messages)
PCB Laminate Properties (2 messages)
PCB Material (for Stress and Deformation Analysis) (3 messages)
PCB noise reduction vs. # of layers (1 message)
PCB Pre Bake (5 messages)
PCB Voltage Testing (2 messages)
PCB vs. Paste Stencil (4 messages)
PCB vs. Paste Stencil Comp (4 messages)
PCB's with SIR patterns (4 messages)
PCB/Hot Air Solder leveling (4 messages)
PCBA Ionic Contamination Levels (2 messages)
PCBoard House (2 messages)
PCMCIA (4 messages)
PCMCIA drilling (1 message)
Periodic Problems With Ox... (1 message)
Periodic Problems With Oxiding (2 messages)
PHOSPHOROUS CONTENT OF NICKEL (2 messages)
photo resist (4 messages)
photo-via technologies (3 messages)
Pin Holes/Blow Holes (2 messages)
Pinholes (3 messages)
PINK POLY BAGS (1 message)
Pink Poly Bags/Shipping PCB Assy's (4 messages)
Pitting Condition on PTFE PWB's (2 messages)
Plasma Cleaning (2 messages)
Plated Through Hole Rim Voids (8 messages)
Plating specification (2 messages)
PLCC Spacing (1 message)
plugging vias (1 message)
Polymer resistors on FR4 (1 message)
Popcorn; Delamination: Floating (3 messages)
pores in Au-platings (1 message)
Post drill cleaning of boards (1 message)
PPM Solder defect rates (1 message)
PRE-BAKE FOR FLEXIBLE CIRCUITS (5 messages)
Press fit padstacks (2 messages)
Press fit technology on ENTEK boards... (3 messages)
Problems with bare copper FPCs (1 message)
Production fab shop selection (2 messages)
PTF - screened EMI shielding (2 messages)
PTFE drilling (3 messages)
pull-pads (7 messages)
Pure Difunctional FR4 Suppliers, (4 messages)
PWB artwork (4 messages)
PWB Design Book (1 message)
PWB Drill File Standards (1 message)
PWB Drilling File standards (1 message)
PWB drilling standards (1 message)
PWB Fab shop Consultant wanted (1 message)
PWB mfgr on Ferrite mtrls (1 message)
PWB SHELFLIFE (3 messages)
PWB Solder defect rates (3 messages)
QCM Technology (1 message)
Quality Control System Software Company Recommendation (1 message)
Quality Management System (3 messages)
Question (2 messages)
Question on design of heat-reliefs (1 message)
Question:Etcher Goop (fwd) (1 message)
Question:TOC on cupric (fwd) (1 message)
RE" Cleanliness Correlation (1 message)
Re.: How do you handle multiple assemblies? (1 message)
RE2: PCBA Ionic Contamination Levels (1 message)
Re: Importance of Drying (1 message)
RE; How do we compare (1 message)
Reflow FAQ's (1 message)
RELEASE FILM USED IN MULTILAYER LAMINATION (1 message)
Reliability of Ni/Au, PCB Finishes (2 messages)
Reliability of SM Solder Joints (1 message)
Removal of non-functional pads (3 messages)
Removal of non-functional... (3 messages)
repairing scratched FR-4 (5 messages)
Replacement for Au Contacts (1 message)
Reply to All job postings (5 messages)
request for details (1 message)
Res-Nets (2 messages)
resdistribute HTE inner copper foil (1 message)
Returned Mail (1 message)
Returned mail: Host unknown (Name server: engult: host not found) (1 message)
Rework Simulation Test Method (3 messages)
Rework Wire Attachment (5 messages)
Reworking BGAs (2 messages)
Re[2]: Where did 30m" for... (2 messages)
Re[3]: Electroless plating (1 message)
RF PTFE Product (1 message)
Rhode Island (1 message)
Rigid Flex Referral (4 messages)
Rigid/Flex: Open Circuits (4 messages)
rim voids (1 message)
RS274-X format (3 messages)
RS274X (2 messages)
RS274X data/Embedded aperture format (1 message)
S-815 (2 messages)
SAE specifications for printed circuit boards (2 messages)
scanning artwork contact (2 messages)
Schematic Symbols [Unidentified subject!] (2 messages)
Scoremarks and break-out lugs (4 messages)
Seeking advice on OSP implementation (4 messages)
Seeking Thru-hole/SMT reference material (2 messages)
Selective Gold Plating (1 message)
Selective Gold Referral (2 messages)
semiconductor die attach methods (1 message)
Shadow problems, help!! (1 message)
Sheets of solder wick? (1 message)
Shelf Life of Pre-Tinned Leadless Components (2 messages)
single ply dielectric and "green" laminate (3 messages)
single sheet (2 messages)
SIR (2 messages)
SIR Manual (2 messages)
SIR Task Group Meeting (1 message)
SIR Test Book (1 message)
SIR Test Methods (3 messages)
SIR Testing (1 message)
SLIP RING SOURCE (2 messages)
SM SKIP IN CURTAINCOAT PROCESS (5 messages)
Small quantities of taped parts on auto-P&P machine (2 messages)
SMART Group Cleraning Survey (1 message)
SMT Accel Reliability Testing (1 message)
SMT Bond Strength Testing per IPC-TM-650, 2.4.21.1 (1 message)
smt fine pitch mods (1 message)
SMT Market (fwd) (1 message)
SMT PCA Bd Temp Sticker (4 messages)
SMT PWB DESIGN (1 message)
SMT Reflow of PTH parts (1 message)
SMT reflow on 20 mil pitch pads (3 messages)
SMT solder defect rates (2 messages)
SO14W TO SO14 ADAPTER (2 messages)
SOIC to Dip Adapters (3 messages)
Solder Balls (4 messages)
Solder Balls and Solder Mask (3 messages)
Solder balls.... (1 message)
Solder Beads on Pasive Components (1 message)
Solder Bridges on SMT SOIC's (6 messages)
Solder Float/Shock Testing (6 messages)
Solder Levelling Thickness (1 message)
solder mask criteria question (3 messages)
Solder Paste Printing "Snap-off"....... (2 messages)
solder resist adhesion promoters (1 message)
Solder Side Actives (3 messages)
Solder Smear (1 message)
Solder splashes. (2 messages)
Solder Under IC's (5 messages)
Solder under SOIC and SOJ packages (2 messages)
solder wave stress (1 message)
Solderability Heat Test (2 messages)
Solderability of Component Lead (2 messages)
Solderability of Electrolytic Tin Plating (3 messages)
Solderable Finishes report (1 message)
Solderballs/Airknife Solution (1 message)
soldering gold pcb,s (4 messages)
Soldering iron discussions (long) (1 message)
Soldering Metal Core IAW ANSI/J-STD-001 (1 message)
Soldering rigid-flex PWBs (1 message)
Soldering tips (2 messages)
Soldering to Gold (2 messages)
soldermask adhesion (2 messages)
Soldermask chemical resis... (1 message)
Soldermask chemical resistance (1 message)
Soldermask via coverage (URGENT) (2 messages)
Solid fill area vs Cross-hatched fill area (1 message)
solubility of gold into solder pot from Ni-Au board (3 messages)
solubility of gold into solder pot from Ni-Au board (8 messages)
SOT23 for LEDs (1 message)
Source for 'Kapak' Bags (2 messages)
Source for Peelable Mask (8 messages)
Source for Peelable Mask (fwd) (1 message)
SPC Stategies (1 message)
Splicing of SMT component tape (4 messages)
Splicing of SMT Tape (1 message)
SRT Rework Station (1 message)
standards (1 message)
Static damage (2 messages)
Static susceptibility test standards (1 message)
Stencil "pad" designs for adhesive application (4 messages)
Storage of SMT components (5 messages)
Supercritical CO2 Cleaning (2 messages)
Surface Mount Jumpers (5 messages)
SURFACE solid fill vs. crosshatched fill (2 messages)
Surface Waviness or Surface roughness for CCL (3 messages)
SURVEY (2 messages)
Survey re Job Postings (10 messages)
System level PCBA allowable flex (1 message)
Tantalum Capacitor Substitutes (2 messages)
Tape Feeders (1 message)
TDR coupons (2 messages)
TDR test frequency (5 messages)
TechCon 95 (1 message)
TechNet - SMT & Micro Vias (1 message)
TechNet inquiry re: immersion gold reliability if not soldered (2 messages)
TechNet Questions - Assembly Yields (2 messages)
[log in to unmask] (1 message)
Temperature Sensing Inks (4 messages)
Tenting via holes (3 messages)
TEST COUPONS (4 messages)
Test Questions Development (2 messages)
Testing Rigid-Flex Mother Boards (2 messages)
Thermal Cycling (1 message)
Thermal Relief Design (3 messages)
Thermal Relief on Vias (5 messages)
Thermocouple attachment (1 message)
thru-hole ir-reflow soldering (1 message)
Time Reduction of SIR Testing (5 messages)
Tin/lead plating vs HAL (4 messages)
Tin/tin vs. Tin/gold sockets (7 messages)
Tinning with Low Residue Flux (1 message)
TINNING WITH LRF (2 messages)
Top of pad measurements (2 messages)
Topside Temp. during assembly (1 message)
Torque (6 messages)
Trace Elements in Legend Ink (5 messages)
Training programs (2 messages)
transition to fine pitch (4 messages)
Ultr Fine Lines/Vias (2 messages)
Ultra-fine lines/small via's (3 messages)
Underwriter's Laboritories Test Patterns (IPC-A-22) (1 message)
Unidentified subject! (9 messages)
Upcoming events (2 messages)
urethane conformal coating (1 message)
Used Microscopes ? (4 messages)
Using ENTEK on Teflon Substrate (6 messages)
UV CURING SYSTEM (2 messages)
UV Curing Systems (1 message)
Vendors for attaching spheres to BGA packages (2 messages)
Via distances from SMT Pads (1 message)
Via in Pad for BGA (2 messages)
Via size question (1 message)
Via solder fill (2 messages)
via to land clearance (1 message)
Via-in pad (1 message)
Via-in-Pad for BGA (3 messages)
Via-in-smt-pad (2 messages)
Vias in SMT pads (2 messages)
vote ON JOB OPENINGS (1 message)
Wanted: Vacuum Sealers (2 messages)
WANTED:THEDA SERVICE BUREAU (1 message)
warping (4 messages)
Wave Solder Fixtures and their effects on profiles.... (2 messages)
Wave Soldering Health Concerns (1 message)
Wave Soldering Machine (3 messages)
Wave Soldering SOIC's without bridging (1 message)
Wave Soldering TSOP Devices (2 messages)
wave soldering with w.s. flux (2 messages)
wavesoldering rigidflex motherboards (1 message)
Web Site for EMPF (1 message)
Web Site for EMPF (fwd) (2 messages)
Wet Processing Nozzles (1 message)
What is a buried resistor ? (5 messages)
What or Who is the SMART Group (2 messages)
What's the optimal baking condition for ML board before IR reflow ? (1 message)
Where did 30m" for Tab plating co (2 messages)
Where did 30m" for Tab plating come from? (5 messages)
Why email (1 message)
Why Gold finish on Cell phone Boards (3 messages)
why photoplot? (4 messages)
Windows, Windows and more Windows (4 messages)
Windows, Windows and more Windows (fwd) (1 message)
Wire Staking for Repairs & ECO's (1 message)
Wires Encapsulated in Kapton (2 messages)
X Ray Inspection Fine Pitch,BGA, Chip (3 messages)
X-out standards (1 message)
X-Outs at Drill (2 messages)
yellow U/V curable legend ink (1 message)
Yields in PC board manufacturing (1 message)
YOU MUST BE PULLING MY PADS (1 message)
zif & lif edge connectors (2 messages)

LISTSERV Archives

LISTSERV Archives

TECHNET Home

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Subject Sorted by Subject, Chronologically

From

Date

Size

New Thread

"CE" standard for Europe

"CE" standard for Europe

Miles Littlefield <[log in to unmask]>

15 Sep 95 20:03:44 EDT

47 lines

re: "CE" standard for Europe

[log in to unmask]

Mon, 18 Sep 95 10:17:26 EDT

42 lines

Re: "CE" standard for Europe

Jerry Cupples <[log in to unmask]>

Mon, 18 Sep 1995 10:25:17 -0500

87 lines

New Thread

"GLASTIC" AND PALLET BOARD MATERIAL

Re: "GLASTIC" AND PALLET BOARD MATERIAL

[log in to unmask]

Fri, 12 May 1995 14:37:53 -0400

40 lines

Re: "GLASTIC" AND PALLET BOARD MATERIAL

Crawford, John A. <[log in to unmask]>

Fri, 12 May 95 16:08:00 EST

69 lines

New Thread

"GLASTIC" INFO REQ

"GLASTIC" INFO REQ

Crawford, John A. <[log in to unmask]>

Thu, 11 May 95 15:45:00 EST

32 lines

"GLASTIC" INFO REQ

Crawford, John A. <[log in to unmask]>

Thu, 11 May 95 15:45:00 EST

32 lines

New Thread

"Unwanted" metal on PWB after etch

"Unwanted" metal on PWB after etch

[log in to unmask]

Thu, 14 Sep 1995 21:46:04 -0400

41 lines

Re: "Unwanted" metal on PWB after etch

David Bergman <[log in to unmask]>

Fri, 15 Sep 1995 10:17:16 -0500 (CDT)

72 lines

New Thread

(Fwd) Re: Nonfunctional Lands

(Fwd) Re: Nonfunctional Lands

TOM HYBISKE <[log in to unmask]>

Tue, 27 Jun 1995 11:06:16

58 lines

New Thread

(Fwd) TechNet Information

(Fwd) TechNet Information

BOB HAYNES <[log in to unmask]>

Wed, 20 Dec 1995 16:36:27

48 lines

Re: (Fwd) TechNet Information

sbryan <[log in to unmask]>

Thu, 21 Dec 95 11:40:08 PST

55 lines

New Thread

(no subject)

(no subject)

Paul Starenas <[log in to unmask]>

Sun, 17 Sep 95 19:58:47 -0700

31 lines

New Thread

(U) Electroless Ni/Au Self-life

(U) Electroless Ni/Au Self-life

[log in to unmask]

Fri, 02 Jun 95 17:34:57 EDT

73 lines

New Thread

(U) IEC 950 standards

(U) IEC 950 standards

[log in to unmask]

Thu, 05 Oct 95 08:49:49 EDT

55 lines

New Thread

...no subject...

...no subject...

Simon Li <[log in to unmask]>

Mon, 3 Jul 95 21:44:43 MDT

36 lines

New Thread

0.020" pitch SMT pad widths

0.020" pitch SMT pad widths

[log in to unmask]

Tue, 15 Aug 95 10:37:28 EDT

51 lines

0.020" pitch SMT pad widths

[log in to unmask]

Tue, 15 Aug 95 21:15:01 EST

46 lines

New Thread

1/4 oz cu

1/4 oz cu

Gary S Thomas <[log in to unmask]>

Wed, 6 Dec 95 10:20:12 EST

36 lines

Re: 1/4 oz cu

[log in to unmask]

Thu, 07 Dec 95 12:08:50 EST

68 lines

New Thread

55110 to IPC-RB-276

55110 to IPC-RB-276

Jack Holm <[log in to unmask]>

Sun, 14 May 95 6:10:35 CDT

44 lines

New Thread

6:30 PM IPC Designers Council Chesapeake Chapter Meeting

6:30 PM IPC Designers Council Chesapeake Chapter Meeting

[log in to unmask]

Thu, 12 Oct 95 05:42:18 EST

52 lines

New Thread

7628 M/L Lay-up

7628 M/L Lay-up

Greg Anderson <[log in to unmask]>

Wed, 27 Sep 95 10:58:00 EDT

48 lines

New Thread

90Pb-10Sn Solder

90Pb-10Sn Solder

Ed Hare <[log in to unmask]>

Fri, 12 May 95 08:40:00 PDT

27 lines

New Thread

?

?

[log in to unmask]

Tue, 05 Dec 95 12:07:11 EST

62 lines

?

[log in to unmask]

Tue, 05 Dec 95 14:42:11 EST

62 lines

New Thread

About TDR coupons

About TDR coupons

Andrew P Magee <[log in to unmask]>

Thu, 7 Sep 95 09:26 EST

56 lines

New Thread

Accelerated aging of solder

Accelerated aging of solder

[log in to unmask]

Tue, 25 Jul 95 13:51:57 MST

42 lines

Re: Accelerated aging of solder

[log in to unmask]

Wed, 26 Jul 95 09:37:46 PST

96 lines

Re: Accelerated aging of solder

David Bergman <[log in to unmask]>

Wed, 26 Jul 1995 13:25:15 -0500 (CDT)

70 lines

New Thread

Acceptance Standards

Acceptance Standards

Larry, Ext 4884, MD 9A <[log in to unmask]>

Tue, 22 Aug 1995 8:27:53 -0500 (CDT)

31 lines

Re: Acceptance Standards

Mike Buetow <[log in to unmask]>

Tue, 22 Aug 1995 12:01:33 -0500 (CDT)

53 lines

New Thread

address for Laura Turbini

address for Laura Turbini

Jerry Cupples <[log in to unmask]>

Thu, 14 Sep 1995 12:07:38 -0500

43 lines

Re: address for Laura Turbini

Evaltine <[log in to unmask]>

Thu, 14 Sep 1995 16:56:44 -0400 (EDT)

58 lines

Re: address for Laura Turbini

David Christopher Whalley <[log in to unmask]>

Fri, 15 Sep 95 08:56:11 bst

24 lines

New Thread

ADHESIVE DISPENSERS

ADHESIVE DISPENSERS

Leo Reynolds <[log in to unmask]>

Fri, 26 May 1995 08:35:43 -0700

33 lines

Re: ADHESIVE DISPENSERS

Pat McGuine <[log in to unmask]>

Fri, 26 May 1995 14:37:43 -0500

49 lines

New Thread

Air entrapment in pastes

Air entrapment in pastes

Michael Fenner <[log in to unmask]>

15 Dec 95 18:46:07 EST

32 lines

New Thread

Alternative to electroless copper

Alternative to electroless copper

[log in to unmask]

Thu, 10 Aug 1995 09:08:22 MST

57 lines

RE: Alternative to electroless copper

Erratic Jackets! <[log in to unmask]>

Thu, 10 Aug 95 13:32:09 EDT

28 lines

New Thread

ALUMINUM COATED PCB

Re: ALUMINUM COATED PCB

Ken Gilleo <[log in to unmask]>

Wed, 26 Apr 1995 15:14:42 -0400 (EDT)

52 lines

ALUMINUM COATED PCB

Crawford, John A. <[log in to unmask]>

Wed, 26 Apr 95 10:22:00 EST

36 lines

New Thread

Anode baskets for Acid Copper plating

Anode baskets for Acid Copper plating

[log in to unmask]

Mon, 11 Sep 1995 16:01:58 -0700

33 lines

Re: Anode baskets for Acid Copper plating

[log in to unmask]

Thu, 14 Sep 95 17:19:18 EST

104 lines

Re: Anode baskets for Acid Copper plating

Andrew P Magee <[log in to unmask]>

Fri, 15 Sep 95 09:56 EST

62 lines

Re: Anode baskets for Acid Copper plating

Lee Bab Kieng <[log in to unmask]>

Tue, 19 Sep 1995 07:03:17 +0800 (SST)

36 lines

New Thread

ANSI Standards

ANSI Standards

Thole, Lothar <[log in to unmask]>

Mon, 14 Aug 1995 18:03 WAT

47 lines

Re: ANSI Standards

Mike Buetow <[log in to unmask]>

Tue, 15 Aug 1995 15:34:32 -0500 (CDT)

71 lines

New Thread

Apology

Apology

Melinda Robinson <[log in to unmask]>

Wed, 13 Sep 1995 15:41:56 -0500 (CDT)

42 lines

Re: Apology

[log in to unmask]

Wed, 13 Sep 1995 17:48:16 -0400

28 lines

New Thread

Append To TechNet By AT&T

Append To TechNet By AT&T

Jay Edwards <[log in to unmask]>

Thu, 8 Jun 95 13:38:27 EDT

125 lines

New Thread

Aramid Base Materials

Aramid Base Materials

[log in to unmask]

Sun, 1 Oct 1995 11:12:48 -0400

34 lines

Re: Aramid Base Materials

[log in to unmask]

Tue, 3 Oct 1995 07:28:27 -0400

29 lines

New Thread

Assembly FAQ's

Assembly FAQ's

Robert Willis <[log in to unmask]>

23 Sep 95 04:47:12 EDT

138 lines

New Thread

ASTM Standards

ASTM Standards

Leila Hady <[log in to unmask]>

Fri, 11 Aug 1995 12:30:24 -0500 (CDT)

40 lines

New Thread

automatic printers

automatic printers

[log in to unmask]

Wed, 22 Nov 1995 06:47:09 EST

73 lines

New Thread

available forums and bulletin boards

available forums and bulletin boards

[log in to unmask]

Fri, 08 Sep 95 19:05:53 EST

31 lines

New Thread

available used CNC Driller / Routers

available used CNC Driller / Routers

THOMAS SMITH <[log in to unmask]>

13 Oct 95 01:03:53 EDT

34 lines

New Thread

Back heating

Back heating

[log in to unmask]

Mon, 11 Sep 1995 16:57:04 -0500

40 lines

New Thread

Backpanel

Backpanel

Thorson, Kevin J @EAG <[log in to unmask]>

Tue, 25 Apr 95 15:30:00 CST

37 lines

New Thread

BAKE TIME

BAKE TIME

[log in to unmask]

Tue, 09 May 95 11:04:00 CST

39 lines

Re: BAKE TIME

R_R_HOLMES <[log in to unmask]>

9 May 95 13:48:48 -0400

92 lines

New Thread

BAKE TIME (fwd)

Re: BAKE TIME (fwd)

Jon Holmen <[log in to unmask]>

Tue, 9 May 1995 13:01:41 -0500 (CDT)

185 lines

Re: BAKE TIME (fwd)

[log in to unmask]

Fri, 12 May 95 15:45:49 EST

59 lines

New Thread

Baking of Boards

Baking of Boards

geiland <[log in to unmask]>

Wed, 10 May 95 13:00:45 CST

25 lines

New Thread

Ball Grid Array

Ball Grid Array

Ofer Segal <[log in to unmask]>

Thu, 17 Aug 95 17:26:50 EST

34 lines

New Thread

Ball Grid Array Vibration Reliability

Ball Grid Array Vibration Reliability

Thorson, Kevin J @EAG <[log in to unmask]>

Tue, 25 Apr 95 16:02:00 CST

44 lines

New Thread

Ball Grid Arrey

Ball Grid Arrey

Ofer Segal <[log in to unmask]>

Tue, 15 Aug 95 16:06:30 EST

33 lines

New Thread

Base material shortages

Base material shortages

[log in to unmask]

Thu, 21 Sep 1995 07:49:38 -0400

55 lines

New Thread

Bellcore - connector lubricants

Bellcore - connector lubricants

Jerry Cupples <[log in to unmask]>

Wed, 25 Oct 1995 15:55:04 -0500

122 lines

New Thread

benchmark/salary

benchmark/salary

Brian R Oatman <[log in to unmask]>

Thu, 24 Aug 1995 15:03:34 -0700

40 lines

New Thread

BGA & CGA Licensing

BGA & CGA Licensing

Ken Selk <[log in to unmask]>

28 Sep 1995 18:34:03 -0700

33 lines

New Thread

BGA Information

BGA Information

Robert Willis <[log in to unmask]>

06 Jul 95 14:46:34 EDT

27 lines

New Thread

BGA Rework

BGA Rework

Dennis Measor <[log in to unmask]>

Thu, 13 Jul 95 17:04:40 EST

57 lines

Re: BGA rework

Usergroup <[log in to unmask]>

Mon, 27 Nov 95 13:19:55

70 lines

New Thread

BGA TECHNOLOGY

BGA TECHNOLOGY

Jim Marsico <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@[log in to unmask]>

Mon, 24 Jul 95 15:14:01 -0400

50 lines

New Thread

BGA Test Manf. Samples

BGA Test Manf. Samples

Thorson, Kevin J @EAG <[log in to unmask]>

Mon, 14 Aug 95 16:38:00 CST

34 lines

New Thread

BGA X-ray video

BGA X-ray video

Robert Willis <[log in to unmask]>

22 Sep 95 03:31:30 EDT

33 lines

New Thread

Blind vias

Blind vias

[log in to unmask]

Mon, 9 Oct 1995 14:53:43 -0400

44 lines

Re: Blind vias

Neil Sellars <[log in to unmask]>

Tue, 10 Oct 95 10:13:30 PDT

52 lines

Re: Blind vias

[log in to unmask]

Tue, 10 Oct 1995 08:51:01 -0400

36 lines

New Thread

Board House Referrals

Board House Referrals

Chester Lao - Process Engineer <[log in to unmask]>

Thu, 17 Aug 1995 11:12:50 -0600 (CST)

47 lines

RE: Board House Referrals

[log in to unmask]

Thu, 17 Aug 95 13:18:39 CDT

37 lines

Board House Referrals

[log in to unmask]

Thu, 17 Aug 95 15:03:55 EST

59 lines

New Thread

Buried Resistors and their tolere

Buried Resistors and their tolere

Mitra Geeban <[log in to unmask]>

Wed, 16 Aug 95 10:11:52 -0400

32 lines

Re: Buried Resistors and their tolere

Robert Blomstrom <[log in to unmask]>

Wed, 16 Aug 95 13:59:21 EDT

49 lines

Re: Buried Resistors and their tolere

[log in to unmask]

Wed, 16 Aug 95 16:04:29 EST

57 lines

New Thread

Burp Cycle!

Burp Cycle!

Brian R Oatman <[log in to unmask]>

Sun, 15 Oct 1995 08:43:12 -0700

36 lines

Re: Burp Cycle!

[log in to unmask]

Mon, 16 Oct 95 17:03:10 EST

70 lines

Re: Burp Cycle!

hbrown <[log in to unmask]>

Tue, 17 Oct 95 08:34:53 PST

58 lines

Re[2]: Burp Cycle!

[log in to unmask]

Tue, 17 Oct 95 09:01:48 MST

94 lines

Re[3]: Burp Cycle!

[log in to unmask]

Tue, 17 Oct 95 16:15:03 EST

109 lines

Re: Burp Cycle!

[log in to unmask]

Tue, 17 Oct 1995 19:07:26 -0400

98 lines

Re[2]: Burp Cycle!

[log in to unmask]

Thu, 19 Oct 95 08:32:15 EST

126 lines

New Thread

C4 DIE ATTACH

C4 DIE ATTACH

Jim Marsico <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@[log in to unmask]>

Tue, 12 Sep 95 12:29:01 -0400

34 lines

New Thread

Cable and Mechanical Workmanship Standards

Cable and Mechanical Workmanship Standards

Barry Allen, Manufacturing Eng. <[log in to unmask]>

Thu, 19 Oct 1995 11:43:21 -0600

28 lines

Re: Cable and Mechanical Workmanship Standards

Jon Holmen <[log in to unmask]>

Thu, 19 Oct 1995 14:25:08 -0500 (CDT)

58 lines

Re: Cable and Mechanical Workmanship Standards

Bill Gaines B160 x2199 <[log in to unmask]>

Thu, 19 Oct 95 16:39:42 PDT

42 lines

Re: Cable and Mechanical Workmanship Standards

[log in to unmask]

Fri, 20 Oct 95 07:20:45 CST

42 lines

Re[2]: Cable and Mechanical Workmanship Standards

[log in to unmask]

Fri, 20 Oct 95 17:37:46 PST

71 lines

New Thread

Cable requirements

Cable requirements

[log in to unmask]

Mon, 23 Oct 95 11:26:10 PST

40 lines

New Thread

cad artwork output

Re: cad artwork output

ScicardsR user id <[log in to unmask]>

Wed, 11 Oct 95 13:09:49 EDT

39 lines

New Thread

Calculating Annular Ring

Calculating Annular Ring

TOM HYBISKE <[log in to unmask]>

Tue, 29 Aug 1995 11:55:24

34 lines

Calculating Annular Ring

[log in to unmask]

Tue, 29 Aug 95 19:20:35 EST

43 lines

New Thread

Call for Papers

Call for Papers

Kimberly Sterling <[log in to unmask]>

Wed, 22 Nov 1995 15:14:11 -0600 (CST)

136 lines

New Thread

Calling all Salesmen NO

Re: Calling all Salesmen NO

dmitchel <[log in to unmask]>

Tue, 14 Nov 95 11:19:37 PST

55 lines

New Thread

Camera - High Magnification

Camera - High Magnification

[log in to unmask]

Wed, 11 Oct 95 09:45:55 CDT

36 lines

Re: Camera - High Magnification

[log in to unmask]

Fri, 13 Oct 95 13:56:42 dst

56 lines

New Thread

Cancelled mil specs... reac

Cancelled mil specs... reac

LISA GREENLEAF <[log in to unmask]>

28 Aug 1995 08:22:10 -0500

38 lines

Re: Cancelled mil specs... reac

[log in to unmask]

Mon, 28 Aug 1995 12:56:13 -0400

56 lines

Re: Cancelled mil specs... reac

Cadence User Account <[log in to unmask]>

Fri, 1 Sep 95 16:46:59 PDT

77 lines

New Thread

CAPACITOR SIZE

CAPACITOR SIZE

Jim Marsico <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@[log in to unmask]>

Wed, 16 Aug 95 12:56:01 -0400

37 lines

RE: CAPACITOR SIZE

[log in to unmask]

Wed, 16 Aug 95 10:43:30 CDT

88 lines

New Thread

capacitor soldering

capacitor soldering

[log in to unmask]

Wed, 10 May 95 12:46:05 cst

41 lines

Re: capacitor soldering

Jon Holmen <[log in to unmask]>

Wed, 10 May 1995 14:57:47 -0500 (CDT)

75 lines

Re: capacitor soldering

Pat McGuine <[log in to unmask]>

Wed, 10 May 1995 17:15:13 -0500

62 lines

Re[2]: capacitor soldering

bwooldri <[log in to unmask]>

Wed, 10 May 95 17:35:50 CST

124 lines

New Thread

CATCH-666

CATCH-666

Al Slagle <[log in to unmask]>

Mon, 30 Oct 95 14:26:50 MST

39 lines

New Thread

Ceramic Capacitor Stress Cracking

Ceramic Capacitor Stress Cracking

Cian O Mathuna <[log in to unmask]>

Wed, 15 Nov 1995 13:21:35 +0000

51 lines

New Thread

Ceramic Passives on FR4

Ceramic Passives on FR4

Rory Doyle <[log in to unmask]>

Thu, 25 May 1995 17:54:16 +0000

58 lines

New Thread

CFC Cleaning Alternatives

CFC Cleaning Alternatives

Crawford, John A. <[log in to unmask]>

Mon, 11 Dec 95 10:17:00 EST

82 lines

New Thread

CFP: European Surface Mount Conference

CFP: European Surface Mount Conference

Peter Swanson <[log in to unmask]>

Fri, 25 Aug 1995 18:50:50 GMT

132 lines

New Thread

Chapter and verse on welded repairs to PWB outers.

Re: Chapter and verse on welded repairs to PWB outers.

ScicardsR user id <[log in to unmask]>

Mon, 6 Nov 95 16:17:00 EST

33 lines

New Thread

Chesapeake Chapter IPC Meeting

Chesapeake Chapter IPC Meeting

Joe Moltz <[log in to unmask]>

Mon, 18 Sep 1995 09:27:25 -0400

35 lines

New Thread

Chesapeake IPC Directions

Chesapeake IPC Directions

pdemaree <[log in to unmask]>

Mon, 18 Sep 95 11:23:00 PDT

59 lines

New Thread

chip-scale attachement

chip-scale attachement

ScicardsR user id <[log in to unmask]>

Thu, 10 Aug 95 14:52:55 EDT

31 lines

Re: chip-scale attachement

Michael Alderete <[log in to unmask]>

Sun, 13 Aug 95 10:41:04 PST

55 lines

Re: chip-scale attachement

Michael Alderete <[log in to unmask]>

Sun, 13 Aug 95 09:20:11 PST

69 lines

Re: chip-scale attachement

Mike Buetow <[log in to unmask]>

Wed, 16 Aug 1995 10:42:28 -0500 (CDT)

60 lines

New Thread

Circuit Board Newsgroup - alt.electronics.manufacture

Re[2]: Circuit Board Newsgroup - alt.electronics.manufacture

Usergroup <[log in to unmask]>

Mon, 27 Nov 95 13:10:00

51 lines

Re[2]: Circuit Board Newsgroup - alt.electronics.manufacture

Usergroup <[log in to unmask]>

Thu, 30 Nov 95 13:36:42

61 lines

New Thread

Circuit Board Newsgroup - alt.electronics.manufacture.circuitboa

Circuit Board Newsgroup - alt.electronics.manufacture.circuitboa

Keith Birchfield (Secondary) <[log in to unmask]>

Tue, 21 Nov 1995 09:01:44 +0000

29 lines

Re: Circuit Board Newsgroup - alt.electronics.manufacture.circuitboa

[log in to unmask]

Wed, 22 Nov 1995 09:19:02 -0500

27 lines

New Thread

Circuit Repair

Circuit Repair

Scott M. Severson <[log in to unmask]>

Wed, 26 Jul 95 16:14:00 -0600

31 lines

Re: Circuit Repair

Dean Barham, x3805/p-0217 <[log in to unmask]>

Wed, 26 Jul 1995 19:38:30 -0500 (EST)

36 lines

Re: Circuit Repair

[log in to unmask]

Wed, 26 Jul 95 16:53:49

72 lines

Re: Circuit Repair

[log in to unmask]

Wed, 26 Jul 95 17:57:11

72 lines

circuit repair

Robert Blomstrom <[log in to unmask]>

Thu, 27 Jul 95 08:49:11 EDT

47 lines

Circuit Repair

Harry Parkinson DTN 264-6760 <[log in to unmask]>

Thu, 27 Jul 95 09:24:14 EDT

78 lines

Circuit Repair

[log in to unmask]

Thu, 27 Jul 95 10:50:47 EST

33 lines

New Thread

CircuiTree info

CircuiTree info

[log in to unmask]

Sat, 28 Oct 95 14:30:23 PST

34 lines

New Thread

CircuiTree info.

CircuiTree info.

[log in to unmask]

Mon, 30 Oct 1995 19:35:56 -0500

24 lines

New Thread

CircuitWorld Web Site

CircuitWorld Web Site

Robert Bormann <[log in to unmask]>

Sun, 11 Jun 95 20:02:19 PDT

49 lines

New Thread

Clarification ; Solder balls

Re: Clarification ; Solder balls

denise rooke <[log in to unmask]>

Mon, 4 Dec 1995 23:24:05 -0500 (EST)

61 lines

Re: Clarification ; Solder balls

Robert Willis <[log in to unmask]>

06 Dec 95 04:02:56 EST

35 lines

Re[2]: Clarification ; Solder balls

Kenneth R Kirby <[log in to unmask]>

Wed, 06 Dec 95 11:23:00 PST

106 lines

New Thread

Clean Rooms

Clean Rooms

David Bergman <[log in to unmask]>

Fri, 7 Jul 1995 15:47:19 -0500 (CDT)

44 lines

New Thread

Cleaning of Roger's Duriod 6002/6010 Material

Cleaning of Roger's Duriod 6002/6010 Material

JWeiss <[log in to unmask]>

21 Nov 1995 10:57:10 EST

34 lines

Re: Cleaning of Roger's Duriod 6002/6010 Material

[log in to unmask]

Tue, 21 Nov 95 13:55:25 EST

47 lines

Re: Cleaning of Roger's Duriod 6002/6010 Material

[log in to unmask]

Wed, 22 Nov 1995 10:42:01 -0500

33 lines

Cleaning of Roger's Duriod 6002/6010 Material

Michael Fenner <[log in to unmask]>

23 Nov 95 19:07:31 EST

42 lines

New Thread

Cleaning PCBd's prior to Conformal Coat

Cleaning PCBd's prior to Conformal Coat

Richard Ackerson <[log in to unmask]>

Fri, 12 May 95 12:53:33 EDT

53 lines

New Thread

Cleaning Rogers Duriod

Cleaning Rogers Duriod

Michael Fenner <[log in to unmask]>

29 Nov 95 19:38:48 EST

46 lines

New Thread

Cleaning Survey Results 91-94

Cleaning Survey Results 91-94

Robert Willis <[log in to unmask]>

09 Dec 95 05:36:30 EST

165 lines

New Thread

CLEANLINESS CORRELATION

CLEANLINESS CORRELATION

Jim Marsico <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@[log in to unmask]>

Tue, 26 Sep 95 14:08:01 -0400

29 lines

Re: CLEANLINESS CORRELATION

John Nelson <[log in to unmask]>

Tue, 26 Sep 1995 11:56:40 -0400 (EDT)

53 lines

New Thread

Cleanliness testing with Omegameter as a contract manufa

Re: Cleanliness testing with Omegameter as a contract manufa

[log in to unmask]

Sat, 21 Oct 95 15:58:12

93 lines

New Thread

Cleanliness testing with Omegameter as a contract manufacturer

Cleanliness testing with Omegameter as a contract manufacturer

Leo Reynolds <[log in to unmask]>

Sat, 21 Oct 1995 07:59:34 -0700

44 lines

Re: Cleanliness testing with Omegameter as a contract manufacturer

[log in to unmask]

Mon, 23 Oct 1995 10:48:12 -0400

52 lines

New Thread

Component lead attachment

Component lead attachment

Phil Belliveau <[log in to unmask]>

Mon, 02 Oct 95 16:17:23

39 lines

Re: Component lead attachment

[log in to unmask]

Wed, 04 Oct 95 09:52:34 dst

42 lines

New Thread

Component Lead Tinning

Component Lead Tinning

[log in to unmask]

Thu, 5 Oct 1995 17:30:28 -0500

48 lines

Re: Component Lead Tinning

Jerry Cupples <[log in to unmask]>

Thu, 5 Oct 1995 19:17:08 -0500

90 lines

RE: Component Lead Tinning

Jim Marsico <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@[log in to unmask]>

Fri, 06 Oct 95 19:23:01 -0400

52 lines

Re[2]: Component Lead Tinning

[log in to unmask]

Mon, 9 Oct 1995 10:04:04 -0500

79 lines

RE: Component Lead Tinning

Crawford, John A. <[log in to unmask]>

Tue, 10 Oct 95 08:53:00 EST

33 lines

New Thread

Component outgassing

Component outgassing

Mike Buetow <[log in to unmask]>

Wed, 16 Aug 1995 17:35:48 -0500 (CDT)

40 lines

New Thread

Component Shortage

Component Shortage

[log in to unmask]

Mon, 02 Oct 95 08:33:34 EST

40 lines

New Thread

COMPONENT TRENDS

COMPONENT TRENDS

Jim Marsico <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@[log in to unmask]>

Thu, 25 May 95 11:55:01 -0400

35 lines

Component Trends

Kimberly Sterling <[log in to unmask]>

Thu, 25 May 1995 10:22:08 -0500 (CDT)

45 lines

Re: COMPONENT TRENDS

Hopkins, Reed <[log in to unmask]>

Thu, 25 May 95 14:10:30

75 lines

Re[2]: COMPONENT TRENDS

[log in to unmask]

Thu, 25 May 95 17:23:15

113 lines

New Thread

Component Trends; Re:

Re: Component Trends; Re:

Michael Alderete <[log in to unmask]>

Tue, 30 May 95 13:45:04 PST

104 lines

New Thread

conductive adhesives

conductive adhesives

Mitch Austin <[log in to unmask]>

Tue, 10 Oct 95 16:59:54 CDT

35 lines

Re: conductive adhesives

David Christopher Whalley <[log in to unmask]>

Wed, 11 Oct 95 16:36:52 bst

57 lines

Re: conductive adhesives

Ken Gilleo <[log in to unmask]>

Wed, 11 Oct 1995 13:48:12 -0400 (EDT)

40 lines

conductive adhesives

Michael Fenner <[log in to unmask]>

12 Oct 95 18:06:34 EDT

51 lines

Conductive adhesives

Michael Fenner <[log in to unmask]>

18 Oct 95 16:23:54 EDT

38 lines

New Thread

conductive adhesives???

Re: conductive adhesives???

Ken Gilleo <[log in to unmask]>

Fri, 13 Oct 1995 07:56:50 -0400 (EDT)

71 lines

Re: conductive adhesives???

David Christopher Whalley <[log in to unmask]>

Mon, 16 Oct 95 12:22:11 bst

38 lines

New Thread

Conductive Epoxy

Conductive Epoxy

Charles Barker/IO-US <[log in to unmask]>

20 Dec 95 16:07:59

41 lines

Re: Conductive Epoxy

dmitchel <[log in to unmask]>

Wed, 20 Dec 95 14:34:49 PST

49 lines

Re: Conductive Epoxy

John Nelson <[log in to unmask]>

Thu, 21 Dec 1995 07:45:19 -0500 (EST)

65 lines

New Thread

Conductor Peel Strength -- Teflon PWB's

Conductor Peel Strength -- Teflon PWB's

[log in to unmask]

Mon, 26 Jun 1995 16:16:55 MST

43 lines

Re: Conductor Peel Strength -- Teflon PWB's

David Bergman <[log in to unmask]>

Tue, 27 Jun 1995 11:28:28 -0500 (CDT)

64 lines

New Thread

Conductor Width

Re: Conductor Width

KNAPP, CLARENCE W. WH:2478 <[log in to unmask]>

Wed, 4 Oct 95 14:23:24 -0700

33 lines

New Thread

Conductor Width Measurement

Conductor Width Measurement

Jim McNeal <[log in to unmask]>

Wed, 04 Oct 1995 11:40:37 -0500

81 lines

Re: Conductor Width Measurement

Vivian Vosburg <[log in to unmask]>

Wed, 4 Oct 1995 14:51:46 -0500 (CDT)

118 lines

Re: Conductor Width Measurement

ScicardsR user id <[log in to unmask]>

Thu, 5 Oct 95 06:50:54 EDT

37 lines

Re: Conductor Width Measurement

[log in to unmask]

Thu, 05 Oct 95 11:51:26 EST

110 lines

Re: Conductor Width Measurement

Jerry Cupples <[log in to unmask]>

Thu, 5 Oct 1995 11:31:40 -0500

71 lines

New Thread

conferences

Re: conferences

Mike Buetow <[log in to unmask]>

Thu, 10 Aug 1995 10:19:08 -0500 (CDT)

69 lines

conferences

Mitra Geeban <[log in to unmask]>

Thu, 10 Aug 95 08:48:56 -0400

38 lines

New Thread

conferences (fwd)

Re: conferences (fwd)

Mike Buetow <[log in to unmask]>

Thu, 10 Aug 1995 11:44:35 -0500 (CDT)

38 lines

New Thread

Conformal coat PC-101

Conformal coat PC-101

Jeffery L. Hempton <[log in to unmask]>

Sun, 22 Oct 1995 08:45:23 -0500

48 lines

Re: Conformal coat PC-101

[log in to unmask]

Mon, 23 Oct 95 19:34:03 PST

70 lines

New Thread

CONNECTOR LUBRICATION METHODS

CONNECTOR LUBRICATION METHODS

AMARKUS <[log in to unmask]>

Thu, 19 Oct 95 20:23:29 CST

31 lines

Re: CONNECTOR LUBRICATION METHODS

Jerry Cupples <[log in to unmask]>

Fri, 20 Oct 1995 10:54:49 -0500

57 lines

Re: CONNECTOR LUBRICATION METHODS

Terry Davey <[log in to unmask]>

Fri, 20 Oct 1995 18:26:12 +0100

65 lines

Re: CONNECTOR LUBRICATION METHODS

Jerry Cupples <[log in to unmask]>

Fri, 20 Oct 1995 14:24:32 -0500

73 lines

New Thread

Connector Placement

Re: Connector Placement

Dwight Mattix (Dwight Mattix) <[log in to unmask]>

Fri, 15 Dec 1995 11:01:01 -0800 (PST)

67 lines

New Thread

Consultant wanted

Re: Consultant wanted

[log in to unmask]

Thu, 26 Oct 1995 14:37:09 -0400

54 lines

Consultant wanted

[log in to unmask]

Wed, 25 Oct 1995 21:31:33 -0400

27 lines

Re: Consultant wanted

[log in to unmask]

Thu, 26 Oct 1995 22:11:15 -0400

23 lines

Re: Consultant wanted

[log in to unmask]

Fri, 27 Oct 1995 00:10:17 -0400

44 lines

Re: Consultant wanted

[log in to unmask]

Fri, 27 Oct 1995 10:07:12 -0400

31 lines

New Thread

CONSULTANTS NEEDED or WANTED

CONSULTANTS NEEDED or WANTED

Robert Willis <[log in to unmask]>

29 Oct 95 05:38:53 EST

28 lines

New Thread

CONSULTANTS NEEDED or WANTED - - to robt willis

Re: CONSULTANTS NEEDED or WANTED - - to robt willis

[log in to unmask]

Sun, 29 Oct 1995 13:56:48 -0500

22 lines

New Thread

CONSULTANTS WANTED

CONSULTANTS WANTED

Bernard Kessler & Associates LTD <[log in to unmask]>

Thu, 26 Oct 95 18:10 EST

65 lines

New Thread

Contacts Needed

Contacts Needed

Pat McGuine <[log in to unmask]>

Thu, 11 May 1995 09:54:39 -0500

35 lines

re: Contacts needed

Jim Marsico <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@[log in to unmask]>

Thu, 11 May 95 16:58:01 -0400

33 lines

Re: Contacts Needed

David Christopher Whalley <[log in to unmask]>

Thu, 11 May 95 18:05:11 bst

25 lines

New Thread

Controlled Impedance

Controlled Impedance

BOB SMITH <[log in to unmask]>

Fri, 7 Jul 95 12:31:46 edt

29 lines

Controlled Impedance

Michael Alderete <[log in to unmask]>

Fri, 07 Jul 95 11:48:00 PST

60 lines

Re: Controlled Impedance

[log in to unmask]

Fri, 07 Jul 95 16:25:08 EST

61 lines

Re: Controlled Impedance

[log in to unmask]

Sat, 08 Jul 95 07:23:20 EST

63 lines

Re: Controlled Impedance

[log in to unmask]

Sat, 8 Jul 1995 23:08:41 -0400

57 lines

Re: Controlled Impedance

R_R_HOLMES <[log in to unmask]>

10 Jul 95 08:32:09 -0400

71 lines

controlled impedance

Mitch Austin <[log in to unmask]>

Mon, 10 Jul 95 09:23:07 CDT

32 lines

New Thread

Controlled Impedence-Teflon

Controlled Impedence-Teflon

[log in to unmask]

Tue, 22 Aug 95 13:04:09 PDT

31 lines

Re: Controlled Impedence-Teflon

[log in to unmask]

Thu, 31 Aug 1995 20:48:23 -0400

70 lines

Re: Controlled Impedence-Teflon

David Bergman <[log in to unmask]>

Fri, 1 Sep 1995 13:06:06 -0500 (CDT)

54 lines

New Thread

Convert from P-55110

Convert from P-55110

Jack Holm <[log in to unmask]>

Thu, 11 May 95 14:57:42 CDT

39 lines

New Thread

Copper Core PWB Assembly

Copper Core PWB Assembly

APeder01 <[log in to unmask]>

16 Aug 1995 09:02:09 EST

41 lines

New Thread

Copper Core PWB Assembly (fwd)

RE: Copper Core PWB Assembly (fwd)

Leila Hady <[log in to unmask]>

Fri, 18 Aug 1995 12:16:54 -0500 (CDT)

71 lines

New Thread

Copper Cored PWA Assembly

Re: Copper Cored PWA Assembly

Letsinger, John F. <[log in to unmask]>

Fri, 18 Aug 95 13:24:00 EST

65 lines

New Thread

Copper thickness Gauges

Copper thickness Gauges

[log in to unmask]

Mon, 10 Jul 95 16:43:18 PDT

33 lines

New Thread

Copper thickness instrument

Copper thickness instrument

[log in to unmask]

Mon, 10 Jul 95 13:09:52 PDT

29 lines

New Thread

copper-at-edge

copper-at-edge

Al Slagle <[log in to unmask]>

Tue, 21 Nov 95 14:10:18 MST

36 lines

Re: copper-at-edge

ScicardsR user id <[log in to unmask]>

Mon, 27 Nov 95 08:36:04 EST

32 lines

Re: copper-at-edge

Al Slagle <[log in to unmask]>

Mon, 27 Nov 95 07:52:41 MST

41 lines

Re: copper-at-edge

Karl J. Bates <[log in to unmask]>

Mon, 27 Nov 95 10:37:06 CST

34 lines

Re: copper-at-edge

[log in to unmask]

Tue, 28 Nov 1995 13:14:11 -0500

40 lines

New Thread

Copy of: Solder Resist Cure Test

Copy of: Solder Resist Cure Test

Robert Willis <[log in to unmask]>

04 Jun 95 13:22:01 EDT

39 lines

Re: Copy of: Solder Resist Cure Test

David Christopher Whalley <[log in to unmask]>

Mon, 5 Jun 95 10:46:04 bst

36 lines

Re: Copy of: Solder Resist Cure Test

[log in to unmask]

Mon, 5 Jun 1995 11:01:42 -0400

34 lines

New Thread

cost of OPC vs HASL

cost of OPC vs HASL

Keith Lumley <[log in to unmask]>

Wed, 13 Sep 1995 13:05:57 -0400

54 lines

New Thread

cost of OSP vs HASL PWB coating

cost of OSP vs HASL PWB coating

Jerry Cupples <[log in to unmask]>

Mon, 11 Sep 1995 17:55:05 -0500

64 lines

RE: cost of OSP vs HASL PWB coating

Stuber, Chuck <[log in to unmask]>

Mon, 11 Sep 95 20:05:00 EDT

98 lines

RE: cost of OSP vs HASL PWB coating

Jerry Cupples <[log in to unmask]>

Tue, 12 Sep 1995 12:21:50 -0500

119 lines

RE: cost of OSP vs HASL PWB coating

Stuber, Chuck <[log in to unmask]>

Tue, 12 Sep 95 20:03:00 EDT

68 lines

New Thread

Cracked MLC capacitors.

Re: Cracked MLC capacitors.

[log in to unmask]

Wed, 20 Dec 95 12:23:30 CST

42 lines

New Thread

Cracking Capacitors

Cracking Capacitors

[log in to unmask]

Mon, 18 Dec 1995 11:39:38 -0500

38 lines

Re: Cracking Capacitors

[log in to unmask]

Mon, 18 Dec 1995 16:32:59 -1000

97 lines

New Thread

Cracking of Type XR7 Multilayer Capacitors

Cracking of Type XR7 Multilayer Capacitors

PETER H. COTE <[log in to unmask]>

20 Dec 1995 11:52:57 -0500

58 lines

New Thread

Cracking of X7R capacitors.

Cracking of X7R capacitors.

Mickey Weiner (2937) <[log in to unmask]>

Wed, 20 Dec 1995 09:10:22 +0200 (IST)

38 lines

New Thread

Cracking X7R capacitors

Cracking X7R capacitors

Phoenix International <[log in to unmask]>

Fri, 15 Dec 1995 11:34:57 -0600 (CST)

36 lines

RE: Cracking X7R capacitors

Daniel F. Shea 2-2410 <[log in to unmask]>

Mon, 18 Dec 95 09:27:25 est

75 lines

New Thread

Crop marks

Crop marks

Al Slagle <[log in to unmask]>

Mon, 30 Oct 95 10:59:55 MST

50 lines

RE: Crop marks

Bob Smith - Foxboro Co <[log in to unmask]>

Tue, 31 Oct 95 10:41:44 est

32 lines

New Thread

CSA, and European Safety requirements

CSA, and European Safety requirements

hbrown <[log in to unmask]>

Mon, 28 Aug 95 15:07:52 PST

31 lines

Re: CSA, and European Safety requirements

[log in to unmask]

Tue, 29 Aug 1995 09:02:16 -0400

33 lines

New Thread

CTE Values for PWB

CTE Values for PWB

[log in to unmask]

Wed, 06 Dec 95 12:37:45 EST

150 lines

New Thread

CTE Values of Printed Circuit Board and Heatsink combina

Re: CTE Values of Printed Circuit Board and Heatsink combina

John Burke <[log in to unmask]>

Tue, 31 Oct 95 16:34:14 GMT

80 lines

New Thread

CTE Values of Printed Circuit Board and Heatsink combinations

CTE Values of Printed Circuit Board and Heatsink combinations

Jim Faris <[log in to unmask]>

Tue, 31 Oct 95 8:54:19 EST

70 lines

New Thread

Current Carrying Capacity of traces and vias

Current Carrying Capacity of traces and vias

Thad McMillan <[log in to unmask]>

Fri, 12 May 95 10:25:04 CST

43 lines

Re: Current Carrying Capacity of traces and vias

Jeff Deeney <[log in to unmask]>

Mon, 15 May 95 15:53:39 MDT

51 lines

New Thread

Current Revs of some IPC Docs

Current Revs of some IPC Docs

Pat McGuine <[log in to unmask]>

Fri, 08 Sep 1995 18:16:26 -0500

41 lines

Re: Current Revs of some IPC Docs

David Bergman <[log in to unmask]>

Mon, 11 Sep 1995 08:48:58 -0500 (CDT)

79 lines

New Thread

DATE CODES

DATE CODES

[log in to unmask]

Tue, 29 Aug 95 07:32:00 CST

28 lines

DATE CODES

[log in to unmask]

Tue, 29 Aug 95 12:40:34 CST

28 lines

Re: DATE CODES

David Bergman <[log in to unmask]>

Fri, 1 Sep 1995 11:47:23 -0500 (CDT)

59 lines

DATE CODES

[log in to unmask]

Sat, 02 Sep 95 00:32:41 EST

32 lines

DATE CODES

[log in to unmask]

Sat, 02 Sep 95 00:32:54 EST

32 lines

Re: DATE CODES

[log in to unmask]

Sat, 2 Sep 1995 16:14:32 -0400

51 lines

New Thread

Defluxing complex electroni

Defluxing complex electroni

Mary Davis <[log in to unmask]>

26 Apr 1995 15:09:20 -0600

52 lines

New Thread

Defluxing Electronic Assemblies

Re: Defluxing Electronic Assemblies

Jim Marsico <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@[log in to unmask]>

Thu, 27 Apr 95 11:40:01 -0400

39 lines

New Thread

delamination

delamination

Mike Cussen <[log in to unmask]>

Mon, 9 Oct 95 17:30 EDT

133 lines

Re: delamination

David Bergman <[log in to unmask]>

Tue, 10 Oct 1995 08:12:03 -0500 (CDT)

318 lines

Re: delamination

Jerry Cupples <[log in to unmask]>

Mon, 9 Oct 1995 21:25:27 -0500

152 lines

Re: delamination

[log in to unmask]

Tue, 10 Oct 1995 14:57:59 -0400

32 lines

New Thread

Delamination/baking boards

Delamination/baking boards

MR NORMAN S EINARSON <[log in to unmask]>

Wed, 11 Oct 1995 16:57:47 EDT

93 lines

Re: Delamination/baking boards

Jerry Cupples <[log in to unmask]>

Thu, 12 Oct 1995 16:05:30 -0500

196 lines

Delamination/baking boards

Robert Willis <[log in to unmask]>

18 Oct 95 12:34:41 EDT

189 lines

Re: Delamination/baking boards

Jerry Cupples <[log in to unmask]>

Thu, 19 Oct 1995 08:10:52 -0500

169 lines

Re: Delamination/baking boards

Robert Willis <[log in to unmask]>

21 Oct 95 08:51:10 EDT

25 lines

New Thread

Delamination/response

Delamination/response

MR NORMAN S EINARSON <[log in to unmask]>

Sat, 14 Oct 1995 14:28:43 EDT

163 lines

Re: Delamination/response

BWOOLDRI <[log in to unmask]>

Mon, 16 Oct 95 10:23:24 CST

175 lines

Re: Delamination/response

Jerry Cupples <[log in to unmask]>

Sun, 15 Oct 1995 23:30:04 -0500

355 lines

New Thread

dendritic growth

dendritic growth

[log in to unmask]

Fri, 6 Oct 1995 22:08:14 -0400

26 lines

New Thread

Dendritic Growth?

Dendritic Growth?

[log in to unmask]

Fri, 6 Oct 95 16:05:01 CDT

55 lines

Re: Dendritic Growth?

Andrew P Magee <[log in to unmask]>

Fri, 6 Oct 95 19:07 EST

102 lines

Re: Dendritic Growth?

[log in to unmask]

Mon, 09 Oct 95 07:55:21 EST

97 lines

Re: Dendritic Growth?

Jerry Cupples <[log in to unmask]>

Mon, 9 Oct 1995 13:16:37 -0500

97 lines

Re[2]: Dendritic Growth?

Andrew P Magee <[log in to unmask]>

Mon, 9 Oct 95 13:15 EST

56 lines

Re: Dendritic Growth?

Mitch Austin <[log in to unmask]>

Tue, 10 Oct 95 14:28:52 CDT

49 lines

Re: Dendritic Growth?

[log in to unmask]

Thu, 12 Oct 1995 08:35:17 -0400

36 lines

New Thread

Design & Documentation Trouble-Shooting

Design & Documentation Trouble-Shooting

Vivian Vosburg <[log in to unmask]>

Tue, 12 Sep 1995 15:44:12 -0500 (CDT)

47 lines

New Thread

designed line width/spacing vs finished board.

designed line width/spacing vs finished board.

Robert Blomstrom <[log in to unmask]>

Thu, 19 Oct 95 14:59:24 EDT

65 lines

Re: designed line width/spacing vs finished board.

David Christopher Whalley <[log in to unmask]>

Mon, 23 Oct 95 16:00:20 gmt

28 lines

New Thread

Dielectric Breakdown BTW Conductors

Dielectric Breakdown BTW Conductors

[log in to unmask]

Wed, 25 Oct 95 13:05:11 EST

43 lines

New Thread

Dielectric Constant variation

Dielectric Constant variation

Thole, Lothar <[log in to unmask]>

Thu, 11 May 1995 10:16 WAT

68 lines

Re: Dielectric Constant variation

[log in to unmask]

Thu, 11 May 1995 15:06:24 -0400

44 lines

Dielectric Constant variation

George Wheadon <[log in to unmask]>

14 May 95 05:25:14 EDT

35 lines

New Thread

difficult soldering on OPC bare copper boards

difficult soldering on OPC bare copper boards

[log in to unmask]

Fri, 18 Aug 95 17:59:03 PST

39 lines

Re: difficult soldering on OPC bare copper boards

[log in to unmask]

Sat, 19 Aug 1995 12:09:12 -0400

32 lines

Re: difficult soldering on OPC bare copper boards

Thad McMillan <[log in to unmask]>

Sun, 20 Aug 95 21:35:12 CST

63 lines

Re: difficult soldering on OPC bare copper boards

Michael Barmuta <[log in to unmask]>

Fri, 25 Aug 1995 09:13:09 DST

90 lines

Re: difficult soldering on OPC bare copper boards

Luke Mendoza <[log in to unmask]>

Tue, 3 Oct 1995 05:34:38 +0800

54 lines

New Thread

DIL component conversion to a surface mount leadform

DIL component conversion to a surface mount leadform

Neil Sellars <[log in to unmask]>

Thu, 24 Aug 95 08:13:59 BST

28 lines

Re: DIL component conversion to a surface mount leadform

brendan mccormack <[log in to unmask]>

Tue, 29 Aug 1995 12:09:24 +0100 (WET DST)

104 lines

Re: DIL component conversion to a surface mount leadform

Jeff Deeney <[log in to unmask]>

Tue, 29 Aug 95 10:07:25 MDT

89 lines

New Thread

dimensional stability

dimensional stability

R_R_HOLMES <[log in to unmask]>

13 Dec 95 12:15:42 -0500

67 lines

Re: dimensional stability

[log in to unmask]

Wed, 13 Dec 95 17:02:15 EST

84 lines

Re: dimensional stability

[log in to unmask]

Wed, 13 Dec 1995 22:13:09 -0500

33 lines

Re[2]: dimensional stability

[log in to unmask]

Thu, 14 Dec 95 11:01:31 EST

56 lines

New Thread

Direct connection of vias to Gnd

Direct connection of vias to Gnd

Steve Quinn <[log in to unmask]>

Tue, 12 Dec 1995 15:57:50 -0600

40 lines

Direct connection of vias to Gnd

[log in to unmask]

Tue, 12 Dec 1995 23:13:44 -0500 (EST)

45 lines

New Thread

Does Spec Exist?

RE: Does Spec Exist?

KNAPP, CLARENCE W. WH:2478 <[log in to unmask]>

Wed, 02 Aug 95 17:17

28 lines

New Thread

Does this spec exsist?

Does this spec exsist?

Andy Richardson <[log in to unmask]>

Wed, 02 Aug 1995 08:23:43 GMT

31 lines

Re: Does this spec exsist?

Jon Holmen <[log in to unmask]>

Wed, 2 Aug 1995 15:02:07 -0500 (CDT)

57 lines

New Thread

Double Treated Copper vs. Standard (Not Black) Oxide(s)

Re: Double Treated Copper vs. Standard (Not Black) Oxide(s)

dmitchel <[log in to unmask]>

Wed, 15 Nov 95 08:41:21 PST

56 lines

New Thread

DRC

DRC

Al Slagle <[log in to unmask]>

Fri, 20 Oct 95 08:52:19 MDT

44 lines

Re: DRC

Robert Blomstrom <[log in to unmask]>

Fri, 20 Oct 95 12:04:14 EDT

70 lines

re: DRC

mike gnieski <[log in to unmask]>

Fri, 20 Oct 95 13:43:01 EDT

77 lines

New Thread

DRC, Netlist Testing, ...

RE: DRC, Netlist Testing, ...

Silbert, Steve <[log in to unmask]>

Tue, 24 Oct 95 17:31:00 EDT

88 lines

New Thread

E-mail address for Laura Turbini

E-mail address for Laura Turbini

[log in to unmask]

Thu, 14 Sep 95 16:32:28 EDT

32 lines

New Thread

Electroless Ni

Electroless Ni

Lee Bab Kieng <[log in to unmask]>

Sat, 26 Aug 1995 07:19:20 +0800 (SST)

38 lines

Electroless Ni

Robert Willis <[log in to unmask]>

26 Aug 95 05:36:26 EDT

24 lines

New Thread

Electroless Ni/Au Self-life

Electroless Ni/Au Self-life

[log in to unmask]

Fri, 2 Jun 1995 11:50:37 -0400

30 lines

New Thread

Electroless plating

Re[3]: Electroless plating

[log in to unmask]

Fri, 17 Nov 95 17:01:05 EST

124 lines

New Thread

EMPLOYMENT OPPORTUNITIES

EMPLOYMENT OPPORTUNITIES

Mike Huffman <[log in to unmask]>

Tue, 2 May 95 11:37:38 EDT

48 lines

Employment Opportunities

[log in to unmask]

Thu, 19 Oct 95 12:28:13 EST

58 lines

Employment Opportunities

[log in to unmask]

Thu, 19 Oct 1995 18:11:57 -0500

43 lines

New Thread

Employment Opportunity

Employment Opportunity

Maureen Mathis <[log in to unmask]>

Mon, 01 May 95 16:46:15 EST

42 lines

Employment Opportunity

Jesse, Ed <[log in to unmask]>

Fri, 20 Oct 95 08:51:00 EST

77 lines

Employment Opportunity

[log in to unmask]

Fri, 20 Oct 1995 15:37:56 -0500

41 lines

Employment opportunity

Sid Tryzbiak <[log in to unmask]>

Tue, 24 Oct 1995 14:03:51 -0400

62 lines

Employment Opportunity

Lehighton Electronics, Inc. <[log in to unmask]>

Mon, 30 Oct 1995 13:21:15 -0500

44 lines

New Thread

encapsulant process

encapsulant process

Mitch Austin <[log in to unmask]>

Wed, 3 May 95 10:46:15 CDT

32 lines

Re: encapsulant process

David Christopher Whalley <[log in to unmask]>

Thu, 4 May 95 18:30:38 bst

36 lines

New Thread

Enthone DSR 3241 Solder Mask

Enthone DSR 3241 Solder Mask

[log in to unmask]

Thu, 04 May 95 16:06:43 EDT

31 lines

Re: Enthone DSR 3241 Solder Mask

jyoung <[log in to unmask]>

Fri, 05 May 95 14:53:59 PST

50 lines

Re: Enthone DSR 3241 Solder Mask

geiland <[log in to unmask]>

Mon, 08 May 95 13:45:31 CST

56 lines

New Thread

EOS/ESD Failure Analysis

EOS/ESD Failure Analysis

[log in to unmask]

Wed, 30 Aug 1995 16:28:41 -0500

29 lines

New Thread

EPA RELEASES HWIR PROPOSAL

EPA RELEASES HWIR PROPOSAL

Christopher Rhodes <[log in to unmask]>

Wed, 22 Nov 1995 12:02:22 -0600 (CST)

63 lines

New Thread

Epoxy Hard Cap Process

Epoxy Hard Cap Process

Luke Mendoza <[log in to unmask]>

Wed, 9 Aug 1995 14:37:31 +0800

34 lines

New Thread

ESD functional test standards

ESD functional test standards

Mitch Austin <[log in to unmask]>

Fri, 13 Oct 95 08:51:49 CDT

36 lines

New Thread

ESD protection ... (fwd)

ESD protection ... (fwd)

Leila Hady <[log in to unmask]>

Fri, 8 Sep 1995 15:41:52 -0500 (CDT)

41 lines

New Thread

ESD Protection requirements

ESD Protection requirements

Britt, Jim (FL40) <[log in to unmask]>

Thu, 07 Dec 1995 09:03:00 -0800 (PST)

35 lines

Re: ESD Protection requirements

Jon Holmen <[log in to unmask]>

Thu, 7 Dec 1995 11:05:20 -0600 (CST)

61 lines

Re: ESD Protection requirements

Jerry Cupples <[log in to unmask]>

Thu, 7 Dec 1995 11:41:09 -0600

91 lines

New Thread

Etchback

Etchback

MR DOUGLAS C JEFFERY <[log in to unmask]>

Sun, 22 Oct 1995 06:43:42 EDT

39 lines

Etchback

Fouquet, Alain <[log in to unmask]>

Tue, 21 Nov 1995 16:33:00 -0500 (EST)

52 lines

Re: Etchback

Jon Holmen <[log in to unmask]>

Fri, 1 Dec 1995 09:43:02 -0600 (CST)

132 lines

New Thread

European "CE" Markings

European "CE" Markings

Crawford, John A. <[log in to unmask]>

Tue, 10 Oct 95 10:32:00 EST

38 lines

Re: European "CE" Markings

[log in to unmask]

Thu, 19 Oct 1995 04:56:48 -0400

54 lines

New Thread

Exacta Circuits / laminates

Exacta Circuits / laminates

Robert Blomstrom <[log in to unmask]>

Fri, 11 Aug 95 16:52:05 EDT

48 lines

Re: Exacta Circuits / laminates

[log in to unmask]

Fri, 11 Aug 95 21:42:05

181 lines

New Thread

Excessive curing

Excessive curing

MR DAVID E MANDER <[log in to unmask]>

Thu, 13 Jul 1995 10:32:00 EDT

39 lines

New Thread

EXCESSIVE CURING OF SOLDER MASK OVER FR4

EXCESSIVE CURING OF SOLDER MASK OVER FR4

Fred Paul <[log in to unmask]>

Mon, 10 Jul 1995 08:02:17 DST

48 lines

Re: EXCESSIVE CURING OF SOLDER MASK OVER FR4

R_R_HOLMES <[log in to unmask]>

12 Jul 95 15:28:26 -0400

69 lines

Re: EXCESSIVE CURING OF SOLDER MASK OVER FR4

[log in to unmask]

Thu, 13 Jul 1995 13:47:48 -0400

28 lines

New Thread

EXPOSE COPPER

EXPOSE COPPER

Augustine Li <[log in to unmask]>

Mon, 21 Aug 95 5:13:45 MDT

100 lines

New Thread

Facility tour, Los Angles area, 4 Oct 95, electronic packaging

Facility tour, Los Angles area, 4 Oct 95, electronic packaging

Bill Gaines B160 x2199 <[log in to unmask]>

Tue, 26 Sep 95 08:33:11 PDT

84 lines

New Thread

Feeds and speeds

Feeds and speeds

[log in to unmask]

Sat, 26 Aug 95 19:37 EDT

41 lines

New Thread

Film Area Calculator NO

Film Area Calculator NO

Robert C Hunt <[log in to unmask]>

Wed, 11 Oct 1995 15:50:00 -0700 (PDT)

51 lines

New Thread

FINAL CLEAN

FINAL CLEAN

[log in to unmask]

Tue, 02 May 95 10:16:31 EST

43 lines

New Thread

final clean equipment after rout

final clean equipment after rout

[log in to unmask]

Wed, 3 May 1995 23:03:28 -0400

31 lines

New Thread

Fine pitch and re-reflow

Fine pitch and re-reflow

Harry Parkinson DTN 264-6760 05-Jul-1995 1437 <[log in to unmask]>

Wed, 5 Jul 95 14:39:00 EDT

94 lines

New Thread

Fine Pitch SMT mods

Fine Pitch SMT mods

Kevin Ditondo <[log in to unmask]>

Fri, 15 Sep 95 08:37:41 EDT

41 lines

Fine Pitch SMT mods

Robert Willis <[log in to unmask]>

16 Sep 95 02:58:08 EDT

28 lines

Re: Fine Pitch SMT mods

Evaltine <[log in to unmask]>

Sat, 16 Sep 1995 20:00:12 -0400 (EDT)

58 lines

Re: Fine Pitch SMT mods

Jerry Cupples <[log in to unmask]>

Mon, 18 Sep 1995 11:05:53 -0500

100 lines

RE: Fine Pitch SMT mods

Jim Marsico <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@[log in to unmask]>

Mon, 18 Sep 95 17:15:01 -0400

37 lines

Re: Fine Pitch SMT Mods

Moffitt, James H. <[log in to unmask]>

Tue, 19 Sep 95 12:01:00 EST

40 lines

Re: Fine Pitch SMT Mods

Jerry Cupples <[log in to unmask]>

Tue, 19 Sep 1995 14:08:04 -0500

106 lines

Re: Fine Pitch SMT Mods

Bill Gaines B160 x2199 <[log in to unmask]>

Wed, 20 Sep 95 07:58:46 PDT

49 lines

New Thread

Flex Circuit Specs

Flex Circuit Specs

[log in to unmask]

Fri, 20 Oct 95 12:21:05 MDT

39 lines

Re: Flex Circuit Specs

David Bergman <[log in to unmask]>

Fri, 20 Oct 1995 15:24:22 -0500 (CDT)

67 lines

RE: Flex Circuit Specs

Cavin Clif <[log in to unmask]>

Fri, 20 Oct 95 13:13:00 MST

55 lines

Re: Flex Circuit Specs

[log in to unmask]

Sat, 21 Oct 1995 09:49:09 -0400

68 lines

New Thread

Flex Processing Frame

Flex Processing Frame

[log in to unmask]

Mon, 18 Sep 95 12:49:25 PDT

30 lines

Re: Flex Processing Frame

Andrew P Magee <[log in to unmask]>

Fri, 22 Sep 95 10:15 EST

63 lines

New Thread

Flexible circuit laminate types.

Flexible circuit laminate types.

BOB HOENE <[log in to unmask]>

Fri, 22 Sep 1995 08:07:56 -0600

35 lines

re: Flexible circuit laminate types.

[log in to unmask]

Fri, 22 Sep 95 09:14:02 PDT

89 lines

New Thread

FLUX & SOLDER PASTE QPL

FLUX & SOLDER PASTE QPL

Jim Marsico <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@[log in to unmask]>

Thu, 05 Oct 95 15:17:01 -0400

29 lines

Re: FLUX & SOLDER PASTE QPL

David Bergman <[log in to unmask]>

Thu, 5 Oct 1995 12:43:28 -0500 (CDT)

57 lines

New Thread

Flux Amount

Flux Amount

[log in to unmask]

Wed, 20 Sep 95 15:07:52 EST

45 lines

RE: Flux Amount

Seppanen Gordy <[log in to unmask]>

21 Sep 1995 08:18:08 U

59 lines

Flux Amount

Robert Willis <[log in to unmask]>

22 Sep 95 12:55:38 EDT

31 lines

Re: Flux Amount

[log in to unmask]

Mon, 25 Sep 1995 09:45:28 -0400

35 lines

New Thread

Foil Lamination

Foil Lamination

APeder01 <[log in to unmask]>

04 Dec 1995 11:02:11 EST

30 lines

Re: Foil Lamination

[log in to unmask]

Sat, 16 Dec 1995 11:01:11 -0500

42 lines

Foil Lamination

[log in to unmask]

Wed, 20 Dec 1995 19:19:55 -0500

44 lines

Re: Foil Lamination

[log in to unmask]

Thu, 21 Dec 1995 14:42:35 -0500

28 lines

New Thread

Foil vs Component Lam.

Foil vs Component Lam.

R_R_HOLMES <[log in to unmask]>

5 Dec 95 08:12:03 -0500

45 lines

Re: Foil vs Component Lam.

[log in to unmask]

Tue, 05 Dec 95 15:18:12 EST

35 lines

New Thread

FR-4 vs FR-5

re: FR-4 vs FR-5

MR DAVID E MANDER <[log in to unmask]>

Fri, 08 Sep 1995 08:21:37 EDT

34 lines

New Thread

FR2/CEM1 laminate properties

FR2/CEM1 laminate properties

David Christopher Whalley <[log in to unmask]>

Mon, 9 Oct 95 13:33:58 bst

31 lines

Re: FR2/CEM1 laminate properties

[log in to unmask]

Mon, 9 Oct 95 11:35:09 CDT

78 lines

New Thread

FR4 versus FR5

FR4 versus FR5

[log in to unmask]

Thu, 7 Sep 95 10:58:48 MDT

36 lines

Re: FR4 versus FR5

TOM HYBISKE <[log in to unmask]>

Thu, 07 Sep 1995 15:41:24

52 lines

Re: FR4 versus FR5

[log in to unmask]

Thu, 14 Sep 1995 10:08:28 -0400

36 lines

New Thread

Fungus Test

Fungus Test

Moffitt, James H. <[log in to unmask]>

Thu, 29 Jun 95 10:35:00 EST

29 lines

Fungus Test

BOB HAYNES <[log in to unmask]>

Fri, 30 Jun 1995 13:56:37

50 lines

New Thread

FW:

FW:

[log in to unmask]

Thu, 04 May 1995 13:00:00 +0000

42 lines

Re: FW:

[log in to unmask]

Thu, 04 May 95 18:57:59

83 lines

New Thread

FW: BGA Test Manf. Samples

FW: BGA Test Manf. Samples

Crawford, John A. <[log in to unmask]>

Wed, 13 Sep 95 13:05:00 EST

83 lines

New Thread

FW: Ni contamination

FW: Ni contamination

Crawford, John A. <[log in to unmask]>

Wed, 13 Sep 95 13:06:00 EST

99 lines

New Thread

FW: Soldering to Gold

FW: Soldering to Gold

Crawford, John A. <[log in to unmask]>

Fri, 15 Dec 95 13:57:00 EST

66 lines

Re: FW: Soldering to Gold

Jerry Cupples <[log in to unmask]>

Fri, 15 Dec 1995 19:27:18 -0600

94 lines

New Thread

FW: Windows, Windows and more Windows

FW: Windows, Windows and more Windows

Crawford, John A. <[log in to unmask]>

Wed, 13 Sep 95 12:59:00 EST

98 lines

New Thread

fwd: Board House Referrals

fwd: Board House Referrals

Stanley Kulak <[log in to unmask]>

17 Aug 95 15:45:13 EDT

75 lines

New Thread

Fwd: Cencorp 540 PCB Depaneling Shear Wanted ! !

Fwd: Cencorp 540 PCB Depaneling Shear Wanted ! !

[log in to unmask]

Sat, 2 Dec 1995 10:51:04 -0500

44 lines

New Thread

fwd: IPC & MIL-STD specs

fwd: IPC & MIL-STD specs

Nanci Baggett <[log in to unmask]>

Thu, 19 Oct 1995 15:23 CST

74 lines

New Thread

fwd: IPC & MIL-STD specs (fwd)

fwd: IPC & MIL-STD specs (fwd)

Vivian Vosburg <[log in to unmask]>

Tue, 12 Dec 1995 13:56:13 -0600 (CST)

60 lines

New Thread

Fwd: plated thru hole rim voids

Fwd: plated thru hole rim voids

MR MIKE V CARANO <[log in to unmask]>

Mon, 18 Dec 1995 23:37:19 EST

56 lines

New Thread

Fwd: Re: Other email forums?

Fwd: Re: Other email forums?

Chris Stack <[log in to unmask]>

Tue, 28 Nov 95 15:42:17

81 lines

New Thread

Fwd: Returned mail

Fwd: Returned mail

[log in to unmask]

Mon, 20 Nov 1995 18:31:38 -0500

70 lines

New Thread

Fwd: Rework Wire Attachment

Fwd: Rework Wire Attachment

Thole, Lothar <[log in to unmask]>

Tue, 29 Aug 1995 14:37 WAT

97 lines

New Thread

FWD: Solder balls....

FWD: Solder balls....

Andy Richardson <[log in to unmask]>

Thu, 21 Sep 1995 09:00:38 GMT

103 lines

New Thread

Fwd: Vias in SMT pads

Fwd: Vias in SMT pads

Sunny Ghajar <[log in to unmask]>

29 Nov 1995 19:04:47 GMT

32 lines

New Thread

Fwd:re: Re: Etchback

Fwd:re: Re: Etchback

[log in to unmask]

Fri, 1 Dec 95 14:44:32 PST

194 lines

New Thread

FWD>RE>Defluxing complex el

FWD>RE>Defluxing complex el

Mary Davis <[log in to unmask]>

27 Apr 1995 12:13:18 -0600

93 lines

New Thread

General PCB Discussions

General PCB Discussions

[log in to unmask]

Tue, 14 Nov 1995 11:50:31 +1100 (EST)

59 lines

New Thread

General Questions

General Questions

[log in to unmask]

Mon, 16 Oct 95 15:22:26 EST

74 lines

Re: General Questions

Richard Davidowsky <[log in to unmask]>

Mon, 16 Oct 1995 17:35:24 -700

43 lines

Re: General Questions

ScicardsR user id <[log in to unmask]>

Tue, 17 Oct 95 07:19:16 EDT

48 lines

New Thread

GETEK

RE: GETEK

Brian R Oatman <[log in to unmask]>

Fri, 01 Dec 1995 10:51:59 -0800

37 lines

New Thread

GETEK Material

GETEK Material

Charlie Fleetwood <[log in to unmask]>

Fri, 1 Dec 95 07:22:35 MST

28 lines

New Thread

Gold coating of SMT pads

Gold coating of SMT pads

Guenter Grossmann <[log in to unmask]>

Wed, 6 Dec 1995 11:16:15 +0100

59 lines

New Thread

Gold Flash Coating

Gold Flash Coating

Len Brown <[log in to unmask]>

Mon, 4 Dec 95 14:29:57 PST

37 lines

RE: Gold Flash Coating

Crawford, John A. <[log in to unmask]>

Tue, 05 Dec 95 08:51:00 EST

98 lines

Gold Flash Coating

Len Brown <[log in to unmask]>

Mon, 4 Dec 95 14:29:57 PST

39 lines

Gold Flash Coating

Len Brown <[log in to unmask]>

Mon, 4 Dec 95 14:29:57 PST

39 lines

Gold Flash Coating

MR NORMAN S EINARSON <[log in to unmask]>

Wed, 06 Dec 1995 13:00:26 EST

60 lines

New Thread

Gold Solder

Gold Solder

[log in to unmask]

Tue, 22 Aug 1995 16:34:40 -0500

32 lines

New Thread

Gold Thickness Requirements for Tabs

Gold Thickness Requirements for Tabs

Steve Joy <[log in to unmask]>

Wed, 30 Aug 95 17:57:37 -0700

41 lines

Gold Thickness Requirements for Tabs

[log in to unmask]

Thu, 31 Aug 95 13:09:14 EDT

47 lines

Gold Thickness Requirements for Tabs

Steve Joy <[log in to unmask]>

Wed, 30 Aug 95 17:57:37 -0700

42 lines

New Thread

Gold Wire Bonding

Gold Wire Bonding

[log in to unmask]

Tue, 19 Sep 95 12:01:52 EST

46 lines

New Thread

HALOGEN/ANTIMONY-FREE COPPER LAMINATE

HALOGEN/ANTIMONY-FREE COPPER LAMINATE

Christopher Rhodes <[log in to unmask]>

Wed, 15 Nov 1995 16:46:22 -0600 (CST)

26 lines

Re: HALOGEN/ANTIMONY-FREE COPPER LAMINATE

[log in to unmask]

Sat, 25 Nov 1995 09:45:32 -0500

47 lines

New Thread

Handling OSP coated PCB's....

Handling OSP coated PCB's....

[log in to unmask]

Fri, 15 Sep 95 09:03:57

55 lines

Handling OSP coated PCB's....

Robert Willis <[log in to unmask]>

16 Sep 95 02:56:10 EDT

33 lines

New Thread

HASL thickness and scoring

HASL thickness and scoring

Chris Stack <[log in to unmask]>

Fri, 27 Oct 95 11:21:00

44 lines

Re: HASL thickness and scoring

[log in to unmask]

Fri, 27 Oct 1995 15:17:48 -0400

44 lines

HASL thickness and scoring

[log in to unmask]

Fri, 27 Oct 95 17:27:36 EST

57 lines

New Thread

HASL vs. Hot Oil Reflow

Re: HASL vs. Hot Oil Reflow

dmitchel <[log in to unmask]>

Wed, 15 Nov 95 12:34:16 PST

38 lines

New Thread

HASL/plate with Sn-Pb-Bi

HASL/plate with Sn-Pb-Bi

[log in to unmask]

18 Sep 95 10:36:31 -0500

30 lines

New Thread

Heat Dissapation

Re: Heat Dissapation

Mike McNulty <[log in to unmask]>

Fri, 13 Oct 1995 10:32:35 -0400

79 lines

New Thread

Help on DIN hardware!

Help on DIN hardware!

Terry Huddleston <[log in to unmask]>

Tue, 5 Dec 1995 06:03:07 -0800

31 lines

New Thread

Hiding component identification

Hiding component identification

Phoenix International <[log in to unmask]>

Fri, 20 Oct 1995 07:50:35 -0500 (CDT)

31 lines

RE: Hiding component identification

Crawford, John A. <[log in to unmask]>

Fri, 20 Oct 95 10:54:00 EST

36 lines

New Thread

High Frecuency PCB

High Frecuency PCB

LAB CIRCUITS <[log in to unmask]>

Wed, 18 Oct 95 21:24:35 0200

36 lines

New Thread

High Frequency PCB

High Frequency PCB

Art Aguayo <[log in to unmask]>

Sun, 22 Oct 95 19:00 EST

40 lines

New Thread

High temperature flux

High temperature flux

John Barrett <[log in to unmask]>

Mon, 4 Sep 1995 12:25:19 +0100 (WET DST)

39 lines

New Thread

High Z Axis Expansion Board Materials

High Z Axis Expansion Board Materials

[log in to unmask]

Sat, 2 Dec 1995 16:25:21 -0500

35 lines

Re: High Z Axis Expansion Board Materials

[log in to unmask]

Sun, 03 Dec 95 15:07:36 EST

73 lines

Re: High Z Axis Expansion Board Materials

denise rooke <[log in to unmask]>

Sun, 3 Dec 1995 22:16:51 -0500 (EST)

65 lines

Re: High Z Axis Expansion Board Materials

[log in to unmask]

Mon, 04 Dec 95 10:38:21 EST

77 lines

Re: High Z Axis Expansion Board Materials

Martin Kennett, Design Engineer <[log in to unmask]>

Tue, 5 Dec 1995 12:47:28 -0600

37 lines

Re: High Z Axis Expansion Board Materials

denise rooke <[log in to unmask]>

Tue, 5 Dec 1995 22:50:21 -0500 (EST)

65 lines

New Thread

Hole to board edge

Hole to board edge

Thad McMillan <[log in to unmask]>

Thu, 26 Oct 95 14:48:48 CST

37 lines

Re: Hole to board edge

[log in to unmask]

Fri, 27 Oct 1995 00:10:18 -0400

28 lines

RE: Hole to board edge

[log in to unmask]

Fri, 27 Oct 95 08:44:58 EST

39 lines

Re[2]: Hole to board edge

[log in to unmask]

Fri, 27 Oct 95 10:29:15 EST

56 lines

Re[2]: Hole to board edge

Thad McMillan <[log in to unmask]>

Fri, 27 Oct 95 09:18:56 CST

57 lines

Hole to board edge

[log in to unmask]

Fri, 27 Oct 95 16:13:36 EST

50 lines

Re: Hole to board edge

[log in to unmask]

Fri, 27 Oct 1995 14:54:20 -0400

38 lines

Re: Hole to board edge

Thomas Stewart <[log in to unmask]>

Fri, 27 Oct 1995 21:11:53 -0700 (PDT)

55 lines

Re: Hole to board edge

[log in to unmask]

Sat, 28 Oct 1995 08:37:09 -0400

29 lines

New Thread

Hole to board edge -Reply

Re[2]: Hole to board edge -Reply

BOB HOENE <[log in to unmask]>

Fri, 27 Oct 1995 13:58:17 -0600

41 lines

New Thread

Housekeeping/Environment Requirements for PWB Fab

Housekeeping/Environment Requirements for PWB Fab

[log in to unmask]

Thu, 17 Aug 95 15:58:28 dst

41 lines

New Thread

How do we compare?

How do we compare?

Al Slagle <[log in to unmask]>

Tue, 24 Oct 95 14:35:02 MDT

42 lines

Re: How do we compare?

[log in to unmask]

Wed, 25 Oct 95 08:03:33 PST

87 lines

Re: How do we compare?

[log in to unmask]

Wed, 25 Oct 95 11:18:07 EST

65 lines

New Thread

http://www.automata.com/ipc/technet1/msg00724.html

http://www.automata.com/ipc/technet1/msg00724.html

Jerry Cupples <[log in to unmask]>

Tue, 05 Sep 95 12:18:18 -2400

116 lines

New Thread

Humidity/Temp Monitor for IC Dry Storage

Humidity/Temp Monitor for IC Dry Storage

[log in to unmask]

Mon, 27 Nov 95 10:14:37 PST

40 lines

Re: Humidity/Temp Monitor for IC Dry Storage

[log in to unmask]

Tue, 28 Nov 1995 09:56:39 -0500

33 lines

New Thread

Ideas for alloys for use in switch contact

Ideas for alloys for use in switch contact

[log in to unmask]

Tue, 22 Aug 95 09:48:31 PST

59 lines

New Thread

ILLINOIS DESIGNERS COUNCIL

ILLINOIS DESIGNERS COUNCIL

Robinson, Peter <[log in to unmask]>

Tue, 10 Oct 1995 15:25:32 -0400

99 lines

New Thread

Immersion gold

Re: Immersion gold

[log in to unmask]

Thu, 14 Sep 1995 21:15:10 -0400

34 lines

New Thread

Impedance test system

Impedance test system

Ian McMilan <[log in to unmask]>

Wed, 16 Aug 1995 17:52:09 +800

37 lines

New Thread

Importance of Drying

Importance of Drying

[log in to unmask]

Mon, 20 Nov 1995 21:59:24 -0500

30 lines

RE: Importance of Drying

Crawford, John A. <[log in to unmask]>

Tue, 21 Nov 95 12:59:00 EST

57 lines

Re: Importance of Drying

[log in to unmask]

Fri, 24 Nov 1995 22:47:17 -0500

30 lines

Re: Importance of Drying

[log in to unmask]

Wed, 29 Nov 1995 22:53:38 -0500

50 lines

New Thread

In-Line X-Ray Inspection Systems for Sol

In-Line X-Ray Inspection Systems for Sol

[log in to unmask]

Wed, 24 May 95 18:22:00 PST

36 lines

New Thread

Industry Pricing Trends

Industry Pricing Trends

Steve Joy <[log in to unmask]>

Thu, 21 Sep 95 17:29:29 -0700

33 lines

Industry Pricing Trends

MR NORMAN S EINARSON <[log in to unmask]>

Sun, 24 Sep 1995 13:52:45 EDT

37 lines

New Thread

Information

Information

WVITALIA <[log in to unmask]>

Fri, 18 Aug 95 15:54:56 est

27 lines

New Thread

Information request

Information request

John F. Berkey <[log in to unmask]>

Wed, 2 Aug 1995 15:00:20 DST

49 lines

Re: Information request

John F. Berkey <[log in to unmask]>

Wed, 2 Aug 1995 15:15:25 DST

46 lines

Re: Information request

[log in to unmask]

Wed, 02 Aug 95 16:15:22 PST

94 lines

New Thread

Insp. of Low Residue Hd. So

Insp. of Low Residue Hd. So

Mary Davis <[log in to unmask]>

25 Sep 1995 11:52:40 -0600

39 lines

New Thread

Intergraph and Massteck PCB Layout Editor

Intergraph and Massteck PCB Layout Editor

OMAR <[log in to unmask]>

Fri, 18 Aug 1995 16:18:40 -0700

32 lines

New Thread

Interleaves and cleanroom NO

Interleaves and cleanroom NO

Robert C Hunt <[log in to unmask]>

Fri, 27 Oct 1995 21:13:00 -0700 (PDT)

60 lines

RE: Interleaves and cleanroom NO

Andrew P Magee <[log in to unmask]>

Mon, 30 Oct 95 17:18 EST

94 lines

New Thread

Internal HTE Copper Foil

Internal HTE Copper Foil

[log in to unmask]

Tue, 21 Nov 95 09:30:51 dst

59 lines

Re: Internal HTE Copper Foil

[log in to unmask]

Sat, 25 Nov 1995 23:31:29 -0500

24 lines

New Thread

Internal Registration

Internal Registration

R_R_HOLMES <[log in to unmask]>

2 Sep 95 10:38:28 -0400

69 lines

Internal Registration

R_R_HOLMES <[log in to unmask]>

13 Sep 95 09:40:34 -0400

94 lines

New Thread

International Glass Suppliers/Weavers

International Glass Suppliers/Weavers

David Bergman <[log in to unmask]>

Thu, 14 Sep 1995 12:57:49 -0500 (CDT)

46 lines

New Thread

Internet Access Address for EMPF

Internet Access Address for EMPF

David T. Novick <[log in to unmask]>

Mon, 21 Aug 95 14:45:38 PST

48 lines

New Thread

Internet Access Address for EMPF (fwd)

RE: Internet Access Address for EMPF (fwd)

Leila Hady <[log in to unmask]>

Wed, 6 Sep 1995 13:46:49 -0500 (CDT)

95 lines

New Thread

Interrupted forum services

Interrupted forum services

Melinda Robinson <[log in to unmask]>

Mon, 4 Dec 1995 13:01:06 -0600 (CST)

60 lines

New Thread

Invisible Sender's Address

Re[2]: Invisible Sender's Address

[log in to unmask]

Fri, 17 Nov 95 17:10:08 EST

53 lines

Re[3]: Invisible Sender's Address

David T. Novick <[log in to unmask]>

Fri, 17 Nov 95 15:20:11 PST

78 lines

New Thread

Ionics and Adhesives

Ionics and Adhesives

[log in to unmask]

Mon, 11 Sep 1995 14:49:58 -0400

97 lines

New Thread

Ionics in adhesives/circuits (fwd)

Ionics in adhesives/circuits (fwd)

Smith, Joshua <[log in to unmask]>

7 Sep 1995 13:41:38 -0600

45 lines

Re: Ionics in adhesives/circuits (fwd)

Tom Cinque <[log in to unmask]>

Thu, 7 Sep 1995 17:14:39 -0400 (EDT)

65 lines

New Thread

IPC & MIL-STD specs

IPC & MIL-STD specs

Ed Murphy <[log in to unmask]>

Wed, 18 Oct 1995 10:56:17 -0700

51 lines

Re: IPC & MIL-STD specs

Pat McGuine <[log in to unmask]>

Wed, 18 Oct 1995 15:39:26 -0500

77 lines

Re[2]: IPC & MIL-STD specs

FRANK, SHARI <[log in to unmask]>

Thu, 19 Oct 95 09:56:45 PST

114 lines

IPC & MIL-STD specs

Miles Littlefield <[log in to unmask]>

19 Oct 95 20:16:01 EDT

52 lines

IPC & MIL-STD specs

[log in to unmask]

Fri, 20 Oct 95 12:48:12 EST

53 lines

Re: IPC & MIL-STD specs

[log in to unmask]

Fri, 20 Oct 95 12:58:37 EST

52 lines

New Thread

IPC & MIL-STD specs (fwd)

RE: IPC & MIL-STD specs (fwd)

Leila Hady <[log in to unmask]>

Fri, 20 Oct 1995 15:58:19 -0500 (CDT)

84 lines

New Thread

IPC 610 Posters

Re: IPC 610 Posters

[log in to unmask]

Wed, 15 Nov 95 16:43:47

67 lines

New Thread

IPC 610 QUESTION

IPC 610 QUESTION

[log in to unmask]

Tue, 21 Nov 1995 12:53:36 -0600

69 lines

Re: IPC 610 QUESTION

Jerry Cupples <[log in to unmask]>

Wed, 22 Nov 1995 16:58:51 -0600

79 lines

Re: IPC 610 QUESTION

Jon Holmen <[log in to unmask]>

Mon, 27 Nov 1995 14:40:25 -0600 (CST)

47 lines

New Thread

IPC Ball Grid Array Symposium

IPC Ball Grid Array Symposium

Kimberly Sterling <[log in to unmask]>

Fri, 15 Dec 1995 13:36:03 -0600 (CST)

34 lines

New Thread

IPC Design Guide

IPC Design Guide

Robert Willis <[log in to unmask]>

20 Sep 95 07:59:56 EDT

26 lines

Re: IPC Design Guide

Mike Buetow <[log in to unmask]>

Wed, 20 Sep 1995 08:47:04 -0500 (CDT)

53 lines

New Thread

IPC Designers Conference and Exhibition

IPC Designers Conference and Exhibition

Kimberly Sterling <[log in to unmask]>

Mon, 30 Oct 1995 09:36:33 -0600 (CST)

43 lines

New Thread

IPC Designers Council Chesapeake Chapter Meeting

IPC Designers Council Chesapeake Chapter Meeting

[log in to unmask]

Tue, 10 Oct 95 22:42:47 EST

49 lines

New Thread

IPC Designers Council Chesapeake Chapter Meeting Schedule

IPC Designers Council Chesapeake Chapter Meeting Schedule

[log in to unmask]

Mon, 11 Sep 95 11:07:43 EST

54 lines

New Thread

IPC Documents

IPC Documents

Jerry Galang <[log in to unmask]>

Thu, 7 Sep 95 09:13 PDT

40 lines

Re: IPC Documents

David Bergman <[log in to unmask]>

Thu, 7 Sep 1995 12:24:28 -0500 (CDT)

59 lines

New Thread

IPC Fall meeting - Important Sessions!

IPC Fall meeting - Important Sessions!

David Bergman <[log in to unmask]>

Mon, 9 Oct 1995 16:36:00 -0500 (CDT)

194 lines

New Thread

IPC Gold Spec

IPC Gold Spec

Joseph L Gangemi <[log in to unmask]>

Thu, 25 May 95 13:30:02 EDT

42 lines

Re: IPC Gold Spec

David Bergman <[log in to unmask]>

Sat, 27 May 1995 19:30:28 -0500 (CDT)

71 lines

New Thread

IPC on the WWW

IPC on the WWW

David Bergman <[log in to unmask]>

Wed, 13 Dec 1995 17:59:26 -0600 (CST)

44 lines

New Thread

IPC Printed Circuits Expo

IPC Printed Circuits Expo

David Bergman <[log in to unmask]>

Wed, 20 Dec 1995 11:37:26 -0600 (CST)

50 lines

New Thread

IPC SPECS

IPC SPECS

[log in to unmask]

Wed, 24 May 1995 15:03:35 -0500 (CDT)

25 lines

Re: IPC SPECS

Mike Buetow <[log in to unmask]>

Wed, 24 May 1995 16:39:09 -0500 (CDT)

45 lines

New Thread

IPC STANDARDS

IPC STANDARDS

[log in to unmask]

Mon, 10 Jul 95 08:01:26 cst

26 lines

Re: IPC STANDARDS

David Bergman <[log in to unmask]>

Mon, 10 Jul 1995 09:00:55 -0500 (CDT)

51 lines

Re: IPC STANDARDS

Jon Holmen <[log in to unmask]>

Mon, 10 Jul 1995 09:09:56 -0500 (CDT)

49 lines

IPC STANDARDS

[log in to unmask]

Wed, 02 Aug 95 13:14:34 CST

30 lines

Re: IPC STANDARDS

Jon Holmen <[log in to unmask]>

Wed, 2 Aug 1995 14:52:33 -0500 (CDT)

69 lines

New Thread

IPC versus Mil-specs

IPC versus Mil-specs

[log in to unmask]

Tue, 1 Aug 95 09:27:56 MDT

36 lines

Re: IPC versus Mil-specs

David Bergman <[log in to unmask]>

Tue, 1 Aug 1995 18:36:45 -0500 (CDT)

65 lines

Re: IPC versus Mil-specs

[log in to unmask]

Wed, 2 Aug 1995 08:33:29 -0400

36 lines

New Thread

IPC-A-600

IPC-A-600

[log in to unmask]

Mon, 19 Jun 95 16:36:30 EDT

30 lines

Re: IPC-A-600

Jon Holmen <[log in to unmask]>

Mon, 19 Jun 1995 16:33:44 -0500 (CDT)

54 lines

New Thread

IPC-A-610 vs ANSI/J-STD-001

IPC-A-610 vs ANSI/J-STD-001

Daniel F. Shea 2-2410 <[log in to unmask]>

Tue, 24 Oct 95 16:52:33 edt

40 lines

Re: IPC-A-610 vs ANSI/J-STD-001

Mike Buetow <[log in to unmask]>

Thu, 26 Oct 1995 13:31:29 -0500 (CDT)

62 lines

Re: IPC-A-610 vs ANSI/J-STD-001

BWOOLDRI <[log in to unmask]>

Thu, 26 Oct 95 13:26:21 CST

66 lines

New Thread

ipc-d-319 (fwd)

ipc-d-319 (fwd)

Christopher Rhodes <[log in to unmask]>

Fri, 13 Oct 1995 10:15:27 -0500 (CDT)

57 lines

Re: ipc-d-319 (fwd)

Jerry Cupples <[log in to unmask]>

Fri, 13 Oct 1995 13:24:51 -0500

80 lines

New Thread

IPC-EM-782

IPC-EM-782

[log in to unmask]

Wed, 13 Sep 1995 13:06:39 -0700

28 lines

New Thread

IPC-SM-782

IPC-SM-782

[log in to unmask]

Fri, 11 Aug 95 08:35:19 BST

35 lines

Re: IPC-SM-782

Mike Buetow <[log in to unmask]>

Fri, 11 Aug 1995 10:33:07 -0500 (CDT)

59 lines

New Thread

IPC-SM-782 1210 FOOTPRINTS

IPC-SM-782 1210 FOOTPRINTS

KEVIN BERRY <[log in to unmask]>

Fri, 27 Oct 1995 11:42:09 -0500

49 lines

Re: IPC-SM-782 1210 FOOTPRINTS

Mike Buetow <[log in to unmask]>

Fri, 27 Oct 1995 13:10:05 -0500 (CDT)

71 lines

Re: IPC-SM-782 1210 FOOTPRINTS

[log in to unmask]

Fri, 27 Oct 1995 15:17:54 -0400

45 lines

Re: IPC-SM-782 1210 FOOTPRINTS

Vivian Vosburg <[log in to unmask]>

Fri, 22 Dec 1995 11:50:23 -0600 (CST)

75 lines

New Thread

IR microscopy need

IR microscopy need

[log in to unmask]

03 Aug 95 13:05:00 -0700

24 lines

New Thread

JIPC/ITRI Technology Exchange Meeting

JIPC/ITRI Technology Exchange Meeting

Toshiki Sasabe 29-Sep-1995 1003 <[log in to unmask]>

Thu, 28 Sep 95 21:09:28 EDT

82 lines

New Thread

job offered

job offered

Omar <[log in to unmask]>

Mon, 30 Oct 95 10:47:02 -0800

51 lines

New Thread

JOB OPENING - ENGINEERING MGMT.

JOB OPENING - ENGINEERING MGMT.

[log in to unmask]

Thu, 26 Oct 1995 19:19:07 -0400

40 lines

New Thread

Job opening: Business Development Manager / Alpha Metals

Job opening: Business Development Manager / Alpha Metals

Karen Tellefsen <[log in to unmask]>

Tue, 19 Dec 1995 13:16:01 -0500

76 lines

New Thread

JOB OPENINGS

JOB OPENINGS

[log in to unmask]

Fri, 04 Aug 95 15:32:50 EST

49 lines

New Thread

Job Opportunities Available

Job Opportunities Available

[log in to unmask]

Thu, 5 Oct 1995 14:12:20 -0400

49 lines

New Thread

Job Opportunity

Job Opportunity

[log in to unmask]

Tue, 3 Oct 1995 16:49:38 -0400

52 lines

New Thread

JOB OPPORTUNITY AVAILABLE

JOB OPPORTUNITY AVAILABLE

[log in to unmask]

Thu, 5 Oct 1995 14:29:28 -0400

52 lines

JOB OPPORTUNITY AVAILABLE

[log in to unmask]

Thu, 5 Oct 1995 14:47:17 -0400

53 lines

New Thread

Job Opportunity for Engineers

Job Opportunity for Engineers

[log in to unmask]

Thu, 5 Oct 1995 12:56:00 -0400

50 lines

New Thread

JOB OPPORUTNITY AVAILABLE

JOB OPPORUTNITY AVAILABLE

[log in to unmask]

Thu, 5 Oct 1995 14:31:58 -0400

52 lines

New Thread

Job Posting

Job Posting

Alan Cable <[log in to unmask]>

Thu, 22 Jun 95 11:41:00 PDT

57 lines

Job Posting

Alan Cable <[log in to unmask]>

Thu, 22 Jun 95 11:06:00 PDT

57 lines

Job Posting

[log in to unmask]

24 Aug 95 15:49:55 -0500

48 lines

New Thread

Job Posting (Not a vote)

Job Posting (Not a vote)

Bob Trinnes <[log in to unmask]>

Wed, 09 Aug 95 18:18:59 EST

34 lines

New Thread

JOB POSTING DIRECTOR OF SALES & MARKETING

JOB POSTING DIRECTOR OF SALES & MARKETING

Leo Reynolds <[log in to unmask]>

Wed, 9 Aug 1995 06:31:22 -0700

34 lines

New Thread

Job Postings

Job Postings

[log in to unmask]

Mon, 07 Aug 95 10:10:30 EST

31 lines

Job Postings

[log in to unmask]

Mon, 7 Aug 95 15:55:24 EDT

26 lines

Re: Job Postings

Mike Buetow <[log in to unmask]>

Mon, 7 Aug 1995 15:07:12 -0500 (CDT)

45 lines

Job postings

Jerry Galang <[log in to unmask]>

Tue, 8 Aug 95 07:47 PDT

47 lines

Job Postings

Houle, Terry R @EAG <[log in to unmask]>

Wed, 09 Aug 95 12:53:00 CST

32 lines

Re: Job Postings

Chris Scholbe <[log in to unmask]>

Wed, 9 Aug 1995 15:10:55 -0400 (EDT)

45 lines

Job Postings

[log in to unmask]

Wed, 9 Aug 1995 19:48:51 -0400

35 lines

Re: Job Postings

[log in to unmask]

Thu, 10 Aug 1995 07:41:45 -0400

27 lines

Re: Job Postings

Brian Walsh <[log in to unmask]>

Thu, 10 Aug 95 08:44:51 EST

28 lines

New Thread

Job Postings - PCB Assembly Engineers

Job Postings - PCB Assembly Engineers

geiland <[log in to unmask]>

Tue, 08 Aug 95 15:15:45 CST

43 lines

New Thread

job postings discussion

job postings discussion

OMAR <[log in to unmask]>

Fri, 11 Aug 95 13:29:21 -0700

42 lines

New Thread

June Program, Los Angles area, electronic packaging

June Program, Los Angles area, electronic packaging

Bill Gaines B160 x2199 <[log in to unmask]>

Thu, 25 May 95 11:03:18 PDT

72 lines

New Thread

Know any good process engineers in search of challenge?

Know any good process engineers in search of challenge?

[log in to unmask]

Wed, 18 Oct 1995 02:29:28 -0400

44 lines

Re: Know any good process engineers in search of challenge?

[log in to unmask]

Wed, 18 Oct 1995 10:38:13 -0400

35 lines

New Thread

LAMINATE DIMENSIONAL TESTING

LAMINATE DIMENSIONAL TESTING

[log in to unmask]

Mon, 4 Dec 95 14:56:29 PST

34 lines

Re: LAMINATE DIMENSIONAL TESTING

[log in to unmask]

Tue, 05 Dec 95 08:32:58 EST

56 lines

New Thread

LAMINATE HISTORY

LAMINATE HISTORY

Bernard Kessler & Associates LTD <[log in to unmask]>

Wed, 6 Sep 95 17:00 EST

64 lines

New Thread

laminate with CTI of 400+

laminate with CTI of 400+

[log in to unmask]

Thu, 10 Aug 1995 04:45:09 EDT

56 lines

Re: laminate with CTI of 400+

[log in to unmask]

Mon, 14 Aug 95 12:59:04

63 lines

Re[2]: laminate with CTI of 400+

jyoung <[log in to unmask]>

Tue, 15 Aug 95 15:23:53 PST

79 lines

Re[2]: laminate with CTI of 400+

[log in to unmask]

Tue, 15 Aug 95 18:46:38 EST

95 lines

Re: laminate with CTI of 400+

[log in to unmask]

Thu, 31 Aug 1995 22:28:40 -0400

40 lines

New Thread

laminate with CTI of 400+.....(resent)

Re: laminate with CTI of 400+.....(resent)

[log in to unmask]

Mon, 14 Aug 95 14:15:21

124 lines

New Thread

Laminates and Prepregs

Laminates and Prepregs

JOHN GULLEY <[log in to unmask]>

Mon, 20 Nov 1995 10:11:00 -0800

40 lines

Laminates and Prepregs

JOHN GULLEY <[log in to unmask]>

Mon, 20 Nov 1995 14:26:02 -0800

49 lines

Laminates and Prepregs

JOHN GULLEY <[log in to unmask]>

Tue, 21 Nov 1995 08:22:13 -0800

54 lines

Re: Laminates and Prepregs

[log in to unmask]

Tue, 21 Nov 1995 21:21:26 -0500

26 lines

Re[2]: Laminates and Prepregs

JOHN GULLEY <[log in to unmask]>

Wed, 22 Nov 1995 16:53:48 -0800

42 lines

New Thread

Lamination pinning

Lamination pinning

R_R_HOLMES <[log in to unmask]>

23 Jul 95 10:29:01 -0400

40 lines

Re: Lamination pinning

[log in to unmask]

Wed, 26 Jul 1995 01:01:33 -0400

24 lines

New Thread

Laser drilling of vias

Laser drilling of vias

[log in to unmask]

Tue, 13 Jun 95 08:31:29 PDT

44 lines

Re: Laser drilling of vias

R_R_HOLMES <[log in to unmask]>

14 Jun 95 07:50:18 -0400

105 lines

Re: Laser drilling of vias

R_R_HOLMES <[log in to unmask]>

14 Jun 95 07:56:14 -0400

103 lines

New Thread

Laser Drilling of vias, posted June 13th

Re:Laser Drilling of vias, posted June 13th

Alan Cable <[log in to unmask]>

Thu, 29 Jun 95 21:42:00 PDT

71 lines

New Thread

Legend Ink

Legend Ink

sbryan <[log in to unmask]>

Sun, 19 Nov 95 11:14:29 PST

40 lines

New Thread

Legend Screen

Legend Screen

[log in to unmask]

Tue, 28 Nov 95 18:23:22 CST

26 lines

New Thread

LONG ISLAND (NY)... DESIGNERS COUNCIL FORMING

LONG ISLAND (NY)... DESIGNERS COUNCIL FORMING

[log in to unmask]

Tue, 11 Jul 95 13:01:49 EDT

36 lines

New Thread

Looking for Information on bare board re-working

Looking for Information on bare board re-working

[log in to unmask]

Thu, 14 Sep 1995 15:43:51 -0400

56 lines

New Thread

Looking for Work

Looking for Work

Crawford, John A. <[log in to unmask]>

Mon, 04 Dec 95 14:18:00 EST

32 lines

Re: Looking for Work

ETHIER_SA <[log in to unmask]>

Wed, 06 Dec 95 16:37:24 EST

75 lines

New Thread

Lot Coding PCBs

Lot Coding PCBs

[log in to unmask]

Wed, 19 Jul 1995 11:09:51 -0400

32 lines

New Thread

lotcoding PCB's

lotcoding PCB's

Josh Moody EXT 4508 <[log in to unmask]>

Mon, 17 Jul 1995 16:51:06 -0700 (PDT)

33 lines

Re: lotcoding PCB's

[log in to unmask]

Tue, 18 Jul 1995 12:23:14 -0400

39 lines

New Thread

LPI Soldermask with Tented Via's

LPI Soldermask with Tented Via's

Jim McNeal <[log in to unmask]>

Fri, 09 Jun 1995 18:28:48 -0500

67 lines

LPI Soldermask with Tented Via's

[log in to unmask]

Sat, 10 Jun 95 12:46:24 EST

43 lines

Re: LPI Soldermask with Tented Via's

Bill Gaines B160 x2199 <[log in to unmask]>

Mon, 12 Jun 95 07:18:03 PDT

37 lines

RE: LPI Soldermask with Tented Via's

Wally Doeling (wallyd) <[log in to unmask]>

Mon, 12 Jun 95 10:23:00 PDT

95 lines

Re: LPI Soldermask with Tented Via's

Jeff Deeney <[log in to unmask]>

Tue, 13 Jun 95 9:44:24 MDT

48 lines

New Thread

MACHINE SHOP CLEANING

MACHINE SHOP CLEANING

Jim Marsico <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@[log in to unmask]>

Thu, 04 May 95 13:05:01 -0400

41 lines

Re: MACHINE SHOP CLEANING

Mary Davis <[log in to unmask]>

4 May 1995 11:10:35 -0600

63 lines

New Thread

Manufacturer's Locator Matrix

Manufacturer's Locator Matrix

[log in to unmask]

Fri, 15 Sep 95 10:47:28 EDT

35 lines

Manufacturer's locator matrix

[log in to unmask]

Wed, 20 Sep 1995 7:57:53 +0100

34 lines

New Thread

Manufacturer's Locator Matrix Inquiry.

Manufacturer's Locator Matrix Inquiry.

[log in to unmask]

Mon, 18 Sep 95 17:34:11 PST

31 lines

Re: Manufacturer's Locator Matrix Inquiry.

Mike Buetow <[log in to unmask]>

Tue, 19 Sep 1995 08:58:07 -0500 (CDT)

49 lines

Re: Manufacturer's Locator Matrix Inquiry.

Jim Marsico <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@[log in to unmask]>

Tue, 19 Sep 95 18:29:01 -0400

34 lines

Re: Manufacturer's Locator Matrix Inquiry.

IRVING LEE, COMPONENT ENGINEERING DEPT/MOD,@TAO <[log in to unmask]>

Tue, 19 Sep 95 17:21:04 PDT

42 lines

New Thread

Manufactures Locator Matrix

Manufactures Locator Matrix

Houle, Terry R @EAG <[log in to unmask]>

Wed, 20 Sep 95 09:18:00 CST

33 lines

Re: Manufactures Locator Matrix

Mike Buetow <[log in to unmask]>

Thu, 21 Sep 1995 14:09:28 -0500 (CDT)

55 lines

New Thread

MARKET SHORTAGES OF LAMINATES AND PREPREGS

MARKET SHORTAGES OF LAMINATES AND PREPREGS

[log in to unmask]

Thu, 21 Sep 1995 00:03:35 -0400

55 lines

New Thread

Masking during Reflow

Masking during Reflow

Peter Swanson <[log in to unmask]>

Tue, 29 Aug 1995 12:12:38 GMT

40 lines

Re: Masking during Reflow

[log in to unmask]

Thu, 31 Aug 1995 22:11:11 -0400

36 lines

New Thread

Mass Lead Trimmers

Mass Lead Trimmers

[log in to unmask]

Tue, 12 Sep 1995 09:29:02 -0400

43 lines

Re: Mass Lead Trimmers

Jerry Cupples <[log in to unmask]>

Tue, 12 Sep 1995 11:16:42 -0500

81 lines

New Thread

Max Operating Temperature

Max Operating Temperature

Frederick A Martin <[log in to unmask]>

18 Oct 95 15:47:45 EDT

35 lines

Re: Max Operating Temperature

[log in to unmask]

Mon, 23 Oct 1995 16:52:24 -0400

33 lines

New Thread

MCM-L Documentation

MCM-L Documentation

APeder01 <[log in to unmask]>

29 Nov 1995 14:08:14 EST

27 lines

Re: MCM-L Documentation

Mike Buetow <[log in to unmask]>

Wed, 29 Nov 1995 16:02:46 -0600 (CST)

55 lines

Re: MCM-L Documentation

Thomas Dammrich <[log in to unmask]>

Thu, 30 Nov 1995 09:35:22 -0600 (CST)

47 lines

Re[2]: MCM-L Documentation

[log in to unmask]

Thu, 30 Nov 95 12:19:35 EST

74 lines

New Thread

Mecseal finish and assemblyproblem

Mecseal finish and assemblyproblem

[log in to unmask]

Thu, 23 Nov 95 12:12:12 EST

49 lines

Mecseal finish and assemblyproblem

[log in to unmask]

Tue, 28 Nov 95 10:17:03 EST

49 lines

Re: Mecseal finish and assemblyproblem

Steve Sarasin <[log in to unmask]>

Wed, 29 Nov 95 07:27:01 EST

48 lines

New Thread

Message for William Waerhouse, Larry Rehder,Sarah Leach,Brian O'brien & Steve Gregory

Message for William Waerhouse, Larry Rehder,Sarah Leach,Brian O'brien & Steve Gregory

David Christopher Whalley <[log in to unmask]>

Tue, 21 Nov 95 09:40:33 gmt

39 lines

New Thread

Mexican Board Shops

Mexican Board Shops

Houle, Terry R @EAG <[log in to unmask]>

Tue, 09 May 95 15:57:00 CST

27 lines

New Thread

Mil Standard Replacements

Mil Standard Replacements

[log in to unmask]

Fri, 8 Dec 1995 15:29:06 -0500

40 lines

Re: Mil Standard Replacements

David Bergman <[log in to unmask]>

Sat, 9 Dec 1995 14:43:46 -0600 (CST)

115 lines

Re: Mil Standard Replacements

Crawford, John A. <[log in to unmask]>

Mon, 11 Dec 95 09:00:00 EST

156 lines

New Thread

MIL-I-46058C Coat. Adh. Cou

MIL-I-46058C Coat. Adh. Cou

Mary Davis <[log in to unmask]>

15 Jun 1995 19:01:35 -0600

36 lines

New Thread

Mil-P-13949

Mil-P-13949

Moffitt, James H. <[log in to unmask]>

Wed, 24 May 95 16:28:00 EST

33 lines

New Thread

Mil-P-13949F

Mil-P-13949F

[log in to unmask]

Wed, 24 May 1995 15:00:47 -0500 (CDT)

28 lines

Re: Mil-P-13949F

Mike Buetow <[log in to unmask]>

Wed, 24 May 1995 16:35:47 -0500 (CDT)

49 lines

Re: Mil-P-13949F

jyoung <[log in to unmask]>

Wed, 24 May 95 15:23:01 PST

37 lines

New Thread

MIL-S-13949H TYPE CF Material

MIL-S-13949H TYPE CF Material

[log in to unmask]

Fri, 12 May 1995 14:47:16 -0400

27 lines

New Thread

Military rigid flex

Military rigid flex

Houle, Terry R @EAG <[log in to unmask]>

Thu, 26 Oct 95 13:50:00 CST

30 lines

New Thread

Minimum Solder Thickness @ Assembly

Minimum Solder Thickness @ Assembly

Glynn Shaw <[log in to unmask]>

Tue, 21 Nov 1995 09:55:00 -0800

38 lines

Re: Minimum Solder Thickness @ Assembly

David Bergman <[log in to unmask]>

Wed, 22 Nov 1995 16:39:06 -0600 (CST)

76 lines

Re: Minimum Solder Thickness @ Assembly

David Christopher Whalley <[log in to unmask]>

Wed, 22 Nov 95 18:29:39 gmt

39 lines

Re: Minimum Solder Thickness @ Assembly

dmitchel <[log in to unmask]>

Wed, 22 Nov 95 11:03:50 PST

65 lines

Re: Minimum Solder Thickness @ Assembly

Walker, Don <[log in to unmask]>

Wed, 22 Nov 95 12:13:31

50 lines

Re: Minimum Solder Thickness @ Assembly

[log in to unmask]

Wed, 22 Nov 1995 16:11:58 -0500

48 lines

New Thread

Minumum Nickel Plating Thickness

Minumum Nickel Plating Thickness

Nancy Nelson <[log in to unmask]>

Thu, 07 Dec 95 12:13:26 CST

31 lines

New Thread

Missing Components

Missing Components

Yerkes, Robert <[log in to unmask]>

Tue, 12 Dec 95 13:35:00 CST

36 lines

New Thread

Mitsubishi Bond Film

Mitsubishi Bond Film

[log in to unmask]

Thu, 14 Dec 95 18:46:04 EST

30 lines

New Thread

More information

More information

Bob Zwicker <[log in to unmask]>

Thu, 14 Dec 95 08:16:00 G

44 lines

New Thread

MULTI-LAYER LAY-UP MATERIAL VERIFICATION

MULTI-LAYER LAY-UP MATERIAL VERIFICATION

[log in to unmask]

Wed, 21 Jun 95 09:05:42 PDT

43 lines

New Thread

Multibus II Backpanels

Multibus II Backpanels

Houle, Terry R @EAG <[log in to unmask]>

Wed, 25 Oct 95 07:31:00 CST

31 lines

Multibus II backpanels

[log in to unmask]

Sat, 28 Oct 95 09:18:54 PST

36 lines

New Thread

Murata Erie Changes

Murata Erie Changes

Jeffery L. Hempton <[log in to unmask]>

Wed, 25 Oct 1995 14:52:44 -0500

63 lines

RE: Murata Erie Changes

Crawford, John A. <[log in to unmask]>

Fri, 27 Oct 95 13:44:00 EST

113 lines

Re[2]: Murata Erie Changes

[log in to unmask]

Mon, 30 Oct 95 09:21:21 PST

133 lines

Re[2]: Murata Erie Changes

[log in to unmask]

Mon, 30 Oct 95 15:46:30 PST

138 lines

New Thread

Net List Testing

Net List Testing

[log in to unmask]

Sat, 21 Oct 95 19:52:15 EST

76 lines

New Thread

New 1507 type glass fabric

New 1507 type glass fabric

[log in to unmask]

Sat, 5 Aug 1995 15:35:06 +0800

28 lines

New Thread

New BGA Via Soldering

New BGA Via Soldering

Robert Willis <[log in to unmask]>

10 Dec 95 12:30:11 EST

106 lines

Re: New BGA Via Soldering

Greg Bartlett <[log in to unmask]>

11 Dec 1995 12:59:04 -0500

62 lines

New Thread

New British Surface Solderability Test Method

New British Surface Solderability Test Method

[log in to unmask]

Mon, 14 Aug 95 11:13:11 dst

46 lines

New British Surface Solderability Test Method

[log in to unmask]

Mon, 14 Aug 95 11:13:11 dst

47 lines

New Thread

New Revisions of RF-276

Re: New Revisions of RF-276

LISA GREENLEAF <[log in to unmask]>

1 Dec 1995 12:52:26 -0400

44 lines

New Thread

New Revisions of RF-276 and A-600

New Revisions of RF-276 and A-600

APeder01 <[log in to unmask]>

01 Dec 1995 08:12:08 EST

26 lines

Re: New Revisions of RF-276 and A-600

Mike Buetow <[log in to unmask]>

Fri, 1 Dec 1995 10:08:00 -0600 (CST)

51 lines

Re: New Revisions of RF-276 and A-600

Jon Holmen <[log in to unmask]>

Fri, 1 Dec 1995 10:30:25 -0600 (CST)

44 lines

New Thread

New SMART Group Cleraning Survey

New SMART Group Cleraning Survey

Robert Willis <[log in to unmask]>

09 Dec 95 05:36:08 EST

98 lines

New Thread

New web site and newsgroup

New web site and newsgroup

[log in to unmask]

Wed, 20 Dec 1995 19:13:42 -0500

64 lines

New Thread

Ni contamination

Ni contamination

[log in to unmask]

Sat, 2 Sep 1995 22:04:30 -0400

30 lines

Re: Ni contamination

Michael Besket <[log in to unmask]>

Tue, 05 Sep 95 07:27:12 PST

47 lines

Ni contamination

[log in to unmask]

Wed, 06 Sep 95 10:41:18 EST

52 lines

New Thread

Ni contamination (fwd)

RE: Ni contamination (fwd)

Leila Hady <[log in to unmask]>

Wed, 6 Sep 1995 14:39:25 -0500 (CDT)

99 lines

New Thread

Nickel Diffusion Barrier

Re: Nickel Diffusion Barrier

Jerry Cupples <[log in to unmask]>

Wed, 27 Sep 1995 14:57:00 -0500

86 lines

Re: Nickel Diffusion Barrier

Lee Bab Kieng <[log in to unmask]>

Fri, 29 Sep 1995 00:12:01 +0800 (SST)

100 lines

Re[2]: Nickel Diffusion Barrier

[log in to unmask]

Fri, 29 Sep 95 13:21:23 EST

123 lines

New Thread

No Clean

No Clean

GEILAND <[log in to unmask]>

Mon, 02 Oct 95 10:02:00 CST

32 lines

New Thread

No clean process impacts (fwd)

No clean process impacts (fwd)

[log in to unmask]

Wed, 26 Apr 1995 16:28:17 -0500 (CDT)

52 lines

New Thread

NO SUBJECT

NO SUBJECT

[log in to unmask]

Sun, 27 Aug 95 00:24:26 EDT

35 lines

NO SUBJECT

Jim Marsico <"marsico%Organization=Industrial & Mfg'g Engineering%Telephone=516-595-5879"@[log in to unmask]>

Fri, 29 Sep 95 16:38:01 -0400

32 lines

NO SUBJECT

[log in to unmask]

Wed, 18 Oct 95 12:35:30 EDT

42 lines

New Thread

No-clean Process Controls

No-clean Process Controls

geiland <[log in to unmask]>

Sun, 02 Jul 95 11:47:15 CST

23 lines

re: No-clean Process Controls

Simon Li <[log in to unmask]>

Mon, 3 Jul 95 18:11:39 MDT

35 lines

Re: No-clean Process Controls

[log in to unmask]

Thu, 6 Jul 1995 09:35:27 -0400

32 lines

Re[2]: No-clean Process Controls

geiland <[log in to unmask]>

Thu, 06 Jul 95 12:50:10 CST

47 lines

New Thread

No-clean process impact

Re: No-clean process impact

[log in to unmask]

Mon, 01 May 95 08:20:01 MST

59 lines

Re: No-clean process impact

[log in to unmask]

Mon, 08 May 95 17:58:19 EDT

88 lines

New Thread

Non solderable toes on QFP's

Non solderable toes on QFP's

John Burke <[log in to unmask]>

Tue, 19 Dec 95 08:25:01 GMT

46 lines

RE: Non solderable toes on QFP's

Crawford, John A. <[log in to unmask]>

Wed, 20 Dec 95 09:37:00 EST

88 lines

New Thread

non-functional

RE: non-functional

Brian R Oatman <[log in to unmask]>

Mon, 16 Oct 1995 19:34:11 -0700

68 lines

New Thread

Non-functional pad removal

Non-functional pad removal

[log in to unmask]

Fri, 20 Oct 95 01:37:52 EST

95 lines

Re: Non-functional pad removal

[log in to unmask]

Mon, 23 Oct 1995 16:51:56 -0400

40 lines

New Thread

Non-Functional PadMy View-- non-functional pads

Re: Non-Functional PadMy View-- non-functional pads

Jack Holm <[log in to unmask]>

Wed, 18 Oct 95 8:04:09 CDT

63 lines

Re: Non-Functional PadMy View-- non-functional pads

Robert Blomstrom <[log in to unmask]>

Wed, 18 Oct 95 11:40:03 EDT

45 lines