Hi there,

Yes, you guessed it - Friday afternoon is my email time - what better way
to relax before the hectic weekend ahead !.. 

I am looking for some info. about board scoring and in particular
proximity of components to scoremarks.  I understand the problems ..
mechanical stressing of solder joints etc. .. but wanted to find out what
spacing people are using out there.

I guess that there should be different spacings dependant on :
-  component package (1206, SOT-23, SOIC etc.)
-  Breaking method (by hand, guillotine, breaking fixture etc.)
-  Score depth etc.

I'd also be interested in feedback from those who use break out lugs on
their panels.

Is anybody willing to share their experiences with the forum? 
I'd appreciate any references  to relevant literature also.

Thanks in advance..


Brendan McCormack
Senior Interconnect Engineer
AMT Ireland
Electronics Manufacturing Centre
University of Limerick
Limerick
Ireland

Ph. +353 61 331588
Fx. +353 61 330316
EM. [log in to unmask]