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Thu, 19 Oct 95 10:04:03 PST
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     Kelly, 
        We also assemble PWA's that have fine pitch parts(.5mm), that are 
     12+ layers, aprox. 350X400mm, and 20mm thick. Our experience is that 
     there is inherently some dimensional instability in boards this big 
     when fabricated with FR4 and FR5. We generally see some GROWTH in at 
     least one of the axis on these boards. I haven't experienced a problem 
     with the boards actually being smaller or shrinking.  
     
        You're right! This problem is most challenging at our solder printing 
        operation.  
     
        Although we have not actually measured the growth, it's in the area 
     of .127mm (.005")max. in either the X or Y dimension. Our stencils are 
     stainless steel and are produced with no compensation for shrink or 
     growth in the PWB. We have been dealing with this by compromising the 
     solderpaste print registration, and splitting the difference across the 
     board. As you indicated the problem gets worse at the extreme outside 
     edges of the board. At component placement, we are using local etched 
     fiducials to optimize component lead to pad registration. We do see 
     some solder bridging as a result of the solder paste deposits being 
     slightly off the pads.  
     
     I am interested in hearing from the Board Fabricators as to what they
     feel is reasonable and possible at their end in helping us deal with this
     problem.
                        Dan Botts
                        Hughes Training Inc.
                        Binghamton, NY                        
______________________________ Reply Separator _________________________________
Subject: PCB vs. Paste Stencil Comp
Author:  [log in to unmask] at CCGATE
Date:    10/18/95 4:08 PM
     
     
From: Kelly Kovalovsky, PCB Quality Engineering                                
~     EMail:[log in to unmask]                                           
Subject: PCB vs. Paste Stencil Comp                                            
We have a fairly large circuit board that we are assembling. The card          
has fine pitch SMT at extreme ends. We have noticed a mismatch between         
the solder paste stencil and the printed circuit board. The circuit            
board features are actually closer together than the stencil.                  
     
My question to any card assembly site is whether it is common practice         
to compensate a solder paste stencil for shrinkage of a PCB?                   
     
IBM Microelectronics Division                                                  
6800 IBM Drive MG12/251                                                        
Charlotte, NC  28262-8563                                                      
     

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