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| Date: | 24 Aug 95 02:53:55 EDT |
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Why dont you just screen print solder paste on to the BGA base and reflow.
Provided you have a low slump paste, reflow in an inert enviroment it works
fine. You will need a micro stencil which is approx, 10 thou in thickness.
Bob Willis
SMART Group UK
Tel 01245 351502
Fax 01245 496123
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