We are studying use of Ni-Au plated circuit boards. One concern which     
     arose is that some of the gold will be dissolved as the board crosses     
     the solder wave and gradually contaminate the pot. Is this a valid        
     concern?                                                                  
     We have never had a copper contamination problem even though we solder    
     many copper boards. We use a dual wave solder and RMA flux.               
     Thanks,                                                                   
     Allen Ahlert                                                              
     [log in to unmask]