We are studying use of Ni-Au plated circuit boards. One concern which 
     arose is that some of the gold will be dissolved as the board crosses 
     the solder wave and gradually contaminate the pot. Is this a valid 
     concern?
     We have never had a copper contamination problem even though we solder 
     many copper boards. We use a dual wave solder and RMA flux.
     Thanks,
     Allen Ahlert
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