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1995

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Subject:
Soldermask chemical resistance
From:
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Date:
Fri, 4 Aug 1995 12:30:46 +0200
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Does anyone have any information or case study references regarding the
chemical resistance of soldermask? Presently we use Peters LPI soldermask
type GL 2469. After electroless nickel and immersion gold process (Aureus,
Shipley) we have noticed peeling effects at soldermask edges. Comments and
suggestions how to avoid these effects are appreciated, either via the IPC
TechNet Forum or directly to my e-mail box.
                                                                            
Thanks
                                                                            
                                                                            
 Kazimierz FRIEDEL
                                                                            
 Eldos, Wroclaw, Poland
                                                                            
 e-mail: [log in to unmask]

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