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Subject:
solubility of gold into solder pot from Ni-Au board
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Date:
Thu, 31 Aug 95 01:54:34 EDT
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FROM: BRUCE HOUGHTON  27/552/844/TOR                                           
Phone  (416) 448-5701     Tie 778-5701                                         
Subject: solubility of gold into solder pot from Ni-Au board                   
Allen,                                                                         
The impact of the gold on the solder pot depends on the % of boards            
that will be nickel/gold, the thickness of the gold (good luck if              
you are using 'plated' gold, instead of immersion gold), how often             
and how well you maintain the solder pot.  You will have to increase           
the frequency of the analysis of the solder pot for gold, until                
you are know what it is performing.                                            
                                                                               
Bruce Houghton                                                                 
Staff Engineer, Celestica, Inc.                                                
Internet:  [log in to unmask]                                              
*** Forwarding note from SMTP2   --IINUS1   08/29/95 14:30 ***

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