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Date: | Wed, 25 Oct 95 07:10:30 PST |
Content-Type: | text/plain |
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Address,
One of the many evaluations we perform on boards is Solderability heat
test. This test simulates the affects of repeated soldering and
desoldering that could possible occur on a PTH in actual production.
Test criteria:
a. Preheat soldering station to 647?F (342?C)
b. Fill PTHs with solder, then desolder. This operation is performed
three times to the same PTH.
c. After Thermal Shock Testing (another separate test), microsection
the PTHs inspect PTHs using 50X~200X.
No cracks in the hole wall or deformation should occur. The maximum
allowance of lifted land from the plane of the base material to the
bottem tip of the land shall be =<30?m.
My question is: Does the 647?F seem abnormal from other vendor specs?
What station temperture are some of the other assembly shops using?
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