Brendan,

I use the following for breakout:

five 0.031" nonplated holes 0.050 center to center,   0.020" in from board edge.
I use a 0.093 route.

----                   ----------
    \                 /
____/|                \_________  board edge
     | #  #  #  #  #   5 holes 0.020 +/-0.005" in from board edge
     |         |
     |         |
-----|         |---- 0.090"



>	From [log in to unmask] Fri Apr 28 13:43:20 1995
>	Resent-Date: Fri, 28 Apr 1995 16:37:11 +0100 (WET DST)
>	Old-Return-Path: <gagme!ul.ie!mccormackb>
>	From: brendan mccormack <[log in to unmask]>
>	Subject: Scoremarks and break-out lugs
>	To: TechNet <[log in to unmask]>
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>	
>	Hi there,
>	
>	Yes, you guessed it - Friday afternoon is my email time - what better way
>	to relax before the hectic weekend ahead !.. 
>	
>	I am looking for some info. about board scoring and in particular
>	proximity of components to scoremarks.  I understand the problems ..
>	mechanical stressing of solder joints etc. .. but wanted to find out what
>	spacing people are using out there.
>	
>	I guess that there should be different spacings dependant on :
>	-  component package (1206, SOT-23, SOIC etc.)
>	-  Breaking method (by hand, guillotine, breaking fixture etc.)
>	-  Score depth etc.
>	
>	I'd also be interested in feedback from those who use break out lugs on
>	their panels.
>	
>	Is anybody willing to share their experiences with the forum? 
>	I'd appreciate any references  to relevant literature also.
>	
>	Thanks in advance..
>	
>	
>	Brendan McCormack
>	Senior Interconnect Engineer
>	AMT Ireland
>	Electronics Manufacturing Centre
>	University of Limerick
>	Limerick
>	Ireland
>	
>	Ph. +353 61 331588
>	Fx. +353 61 330316
>	EM. [log in to unmask]
>	
>	
>	
>	
>
>
>
-Pat-

-------------
Patrick McGuine
[log in to unmask]
(608) 276-6334