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| Date: | Thu, 28 Sep 1995 17:27:39 -0500 |
| Content-Type: | text/plain |
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In evaluating temperature profiles for an IR reflow system, I am
looking for the best method of attaching thermocouples to a polyimide
substrate, the board surface finish, and the SMD.
The solder paste has a 280 deg/C (eutectic) reflow temp; therefore the
method used needs to be capable of surviving temps @ or above 350 deg
Celsius.
Any recommendations ???
DJDrake
DRAKE@SSDSRDCC
(713) 987-4365
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