I am looking for some technical information/ assistance regarding 
     component lead tinning. 
     
     Does anyone have any experience with a tinning process causing thermal 
     shock to integrated circuits that would cause them to separate at the 
     lead frame bond ? What is an acceptable thermal ramp rate ? 
     
     The solder pot is held at 313 deg. Celsius (high temp solder), the 
     component is suspended in type "RMA" flux for 5 seconds and then 
     suspended in the solder pot for another 5 seconds. This process is 
     repeated for two cycles. We are using an automated tinning machine 
     which controls emmersion speed and depth for both the solder and flux.
     
     What is the typical thermal ramp rate that a component, such a DIP, is 
     able to withstand ? This includes the cool-down (second immersion into 
     flux prior to second tinning cycle is approximately 8 seconds).
     
     Any ideas ?
     
     DRAKE@SSDSRDCC
     
     Darrell Drake
     (713) 987-4365