I am looking for some technical information/ assistance regarding component lead tinning. Does anyone have any experience with a tinning process causing thermal shock to integrated circuits that would cause them to separate at the lead frame bond ? What is an acceptable thermal ramp rate ? The solder pot is held at 313 deg. Celsius (high temp solder), the component is suspended in type "RMA" flux for 5 seconds and then suspended in the solder pot for another 5 seconds. This process is repeated for two cycles. We are using an automated tinning machine which controls emmersion speed and depth for both the solder and flux. What is the typical thermal ramp rate that a component, such a DIP, is able to withstand ? This includes the cool-down (second immersion into flux prior to second tinning cycle is approximately 8 seconds). Any ideas ? DRAKE@SSDSRDCC Darrell Drake (713) 987-4365