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I am looking for some technical information/ assistance regarding
component lead tinning.
Does anyone have any experience with a tinning process causing thermal
shock to integrated circuits that would cause them to separate at the
lead frame bond ? What is an acceptable thermal ramp rate ?
The solder pot is held at 313 deg. Celsius (high temp solder), the
component is suspended in type "RMA" flux for 5 seconds and then
suspended in the solder pot for another 5 seconds. This process is
repeated for two cycles. We are using an automated tinning machine
which controls emmersion speed and depth for both the solder and flux.
What is the typical thermal ramp rate that a component, such a DIP, is
able to withstand ? This includes the cool-down (second immersion into
flux prior to second tinning cycle is approximately 8 seconds).
Any ideas ?
DRAKE@SSDSRDCC
Darrell Drake
(713) 987-4365
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