In evaluating temperature profiles for an IR reflow system, I am looking for the best method of attaching thermocouples to a polyimide substrate, the board surface finish, and the SMD. The solder paste has a 280 deg/C (eutectic) reflow temp; therefore the method used needs to be capable of surviving temps @ or above 350 deg Celsius. Any recommendations ??? DJDrake DRAKE@SSDSRDCC (713) 987-4365