In evaluating temperature profiles for an IR reflow system, I am 
     looking for the best method of attaching thermocouples to a polyimide 
     substrate, the board surface finish, and the SMD. 
     
     The solder paste has a 280 deg/C (eutectic) reflow temp; therefore the 
     method used needs to be capable of surviving temps @ or above 350 deg 
     Celsius.
     
     Any recommendations ???
     
     DJDrake
     DRAKE@SSDSRDCC
     (713) 987-4365