Pat

I have saved 27 email messages on osp's from the last year of TechNet 
transactions.  These range from cost issues to PTFE processing.  I can 
forward them if you are interested and have not seen them in the past.

Regards

Dave
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David W. Bergman, Technical Director
IPC
2215 Sanders Road
Northbrook, IL  60062-6135
708-509-9700 x340 Phone
708-509-9798 Fax
email  [log in to unmask]
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On Tue, 12 Dec 1995 [log in to unmask] wrote:

> I would greatly appreciate any input regarding changing from 
> HASL to OSP.  We assemble heavy copper boards and are 
> experiencing difficulties as we move to 0805 chip packages.  We 
> are comtemplating changing to OSP to alleviate some of the 
> pain.  I would appreciate any info regarding process changes we 
> may have to make (pad design, pre-heat, flux application 
> method, etc).  A typical application is 4 layer board with 2 
> oz. internals and 2 oz. externals plated to 3 oz.  Three 
> thermal cycles (top side reflow, bottom side epoxy cure, and 
> wave solder).  SOIC and SOT-23 on top, 0805 on bottom, plus 
> through hole components.  No-clean paste and wave solder flux, 
> wave flux applied by foaming on most machines but spray fluxer 
> also available.  Assemblies have high thermal mass (large 
> magnetics and heatsinks).  Thanks for your help.
> 
> Pat Bailey
> Zytec Corporation
> phone 507 637-2966 x355
> fax 507 644-3720
> e-mail [log in to unmask]
> 
>