Could someone provide advice or comments about treatments to promote solder
mask adhesion?  I'm thinking of treatments to copper on outer layers.  We
have been having some problems with LPI.  Dry film has been OK.  

Our plant has been using something called an "OXIDE LITE" (a homemade
process) on outer layer copper.  It involves putting the panels through a few
steps of the inner layer oxide bath, that's all I know for the moment.  The
process is timeconsuming and thus expensive, and may have a bad effect on the
oxide baths.  Our chemist wants to know if there is anything better that this
"LITE" process for treating the copper to help solder resist adhesion.
 Thanks for any comments.

Lou Hart