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| Date: | Fri, 8 Dec 95 09:19:34 GMT |
| Content-Type: | text/plain |
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In response to Bill Fabry's suggestion regarding Via in Pad for BGA:
An excellent thought.
As I see it you would also enhance the heat removal from the BGA significantly,
and by using an electrically isolating but thermally conducting adhesive, a
heat sink could then be mounted on the secondary side after the tests are
completed.
Tom Moore
Analog Devices,
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