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Subject:
From:
Andrew P Magee <[log in to unmask]>
Date:
Tue, 22 Aug 95 18:19 EST
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In QA testing our flex materials, we bake them for 1 hr. at 257F. In accordance
with IPC-TM-650, 2.4.13, para. 5.1

Andy Magee - Applications Engineer
Rogers - Circuit Materials Unit
Phone: (602) 917-5237
FAX: (602) 917-5256
E-Mail: [log in to unmask]

______________________________ Reply Separator _________________________________
Subject: Solder Float/Shock Testing
Author:  EnviEng (EnviEng) {NAME:EnviEng|EMS:INTERNET|MBX:[log in to unmask] at
MCIMAIL
Date:    8/22/95 1:33 PM


Hello all:

We would like some information on temperature and time required prior to
testing a sample in the solder pot for solder float/shock testing.

We checked in the IPC Test Methods but could not find the specific
information that we were looking for.  Any help would be greatly appreciated!

Sincerely,

Lou Cerone, Process Engineer
Benny George, Quality Control Tech



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