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1995

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Subject:
From:
Date:
Thu, 14 Sep 1995 21:10:39 -0400
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Problem:
We experience an unacceptable failure rate with open in rigid flex boards
AFTER assemby and thermal cycling.

Question: 
I feel there is a good chance the problem is in the assembly process.  What
kind of things should I look for?  The boards are mixed surface mount and
thru-hole, with much hand soldering and rework.

Thanks
George Franck 



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