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1995

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Subject:
PCB Pre Bake
From:
ian graham <[log in to unmask]>
Date:
Fri, 8 Sep 1995 09:49:58 +0930 (CST)
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What time/temperature profile is suitable for FR4 and FR5 prebaking prior 
to assembly?

Process is print, place and reflow.

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Ian Graham	[log in to unmask]

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