This is a late response to the note sent by Gary Willard (Motorola UK).

You mention that you are under the impression that as the phosphorous content
increases, solderability improves but ductility decreases.

I'm afraid that in fact, it is the exact opposite.

A reference you can check for more details is:


   Konrad Parker, "Electroless nickel: state of the art", Plating and
   surface finishing, March 1992, p29-33.


Richard Langlois
IBM Canada, Bromont
email: [log in to unmask]