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| Date: | Tue, 15 Aug 1995 10:40:26 -0400 |
| Content-Type: | text/plain |
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I could use some assistance in defining 'popcorn effect,' delamination,' and
'floating' as it applies to components (BGA, fine pitch packages).
Any other known common component level phenomena (seen during
assembly/soldering) and words used to identify them would be much appreciated
as well.
Thank you,
Patrick Hassell
Electronic Packaging Services
(404) 524-0888
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