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| From [log in to unmask] Sat Apr 27 14: |
32:31 1996 |
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I could use some assistance in defining 'popcorn effect,' delamination,' and
'floating' as it applies to components (BGA, fine pitch packages).
Any other known common component level phenomena (seen during
assembly/soldering) and words used to identify them would be much appreciated
as well.
Thank you,
Patrick Hassell
Electronic Packaging Services
(404) 524-0888
[log in to unmask]
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