 
| Subject: | |
| From: | |
| Date: | Wed, 27 Sep 1995 11:34:43 -0400 |
| Content-Type: | text/plain |
| Parts/Attachments: |
|
|
Does anyone have any experience soldering surface mount devices to
Electrolytic Tin plating as opposed to Tin/Lead reflow or HAL? We have a
customer that is interested in this but wants us to ensure that they'll be
able to solder the boards. They are using a BTU convection oven for
reflowing the boards after assembly. Thanks in advance for any
correspondence.
|
|
|
