 
| Received: |
by ipchq.com (Smail3.1.28.1 #2)
id m0sxz7H-0000HEC; Wed, 27 Sep 95 11:13 CDT |
| Old-Return-Path: |
|
| Date: |
Wed, 27 Sep 1995 11:34:43 -0400 |
| Precedence: |
list |
| X-Loop: |
|
| Message-ID: |
|
| X-Status: |
|
| Status: |
O |
| X-Mailing-List: |
|
| TO: |
|
| Return-Path: |
|
| Resent-Message-ID: |
<"8fDcx3.0.o6A.XWNQm"@ipc> |
| Subject: |
|
| From: |
|
| Resent-From: |
|
| Resent-Sender: |
|
| From [log in to unmask] Sat Apr 27 14: |
53:46 1996 |
| Parts/Attachments: |
|
|
Does anyone have any experience soldering surface mount devices to
Electrolytic Tin plating as opposed to Tin/Lead reflow or HAL? We have a
customer that is interested in this but wants us to ensure that they'll be
able to solder the boards. They are using a BTU convection oven for
reflowing the boards after assembly. Thanks in advance for any
correspondence.
|
|
|
