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1995

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Subject:
Re: Stencil "pad" designs for adhesive application
From:
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Date:
Thu, 21 Dec 1995 10:36:14 -0500
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I have stenciled adhesives and we used a rectangular appeture approx. .010" x
.055" placed directly in the center of the components, except for SOICs then
we used multiple ones to eliminate the possibility of part shifting.

Hope this helps.

Marty Greene
President --  Circuits, Inc.

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