We have had some Cmos electronic assemblies delivered to us from a 
sub-contractor that were packed in ordinary brown recycled cardboard 
inners with no antistatic bag protection. The cardboard inners were in 
contact with parts of the circuit. They were delivered by road over long 
distance, about 2000 miles. The boards were packed in an antistatic 
environment, so the only risk is of static damage due to movement in the 
packaging while in transit. 



We would like some opinions on the level of certainty with which any 
static damage would be detected by our normal ICT and temperature cycled 
soak testing procedures. We are concerned that some devices may have been 
degraded without failing totally, causing reliability problems in the 
field. Is there any data available which would give us either the 
certainty to scrap the boards, or embark on a testing program which would 
give us assurance that the boards are not likely to fail after passing 
these tests.