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Date: | Tue, 29 Aug 1995 12:25:07 -0400 (EDT) |
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I would suggest that the variability in solder thickness that Etidwell
reported is likely the normal variation that comes with hot air solder
leveling.
Therein lies the reason the most of the SMT industry is seeking alternative
processes such as Electroless Nickel/Immersion Gold, Electroless Palladium,
CU-56 coatings and the like in a grand effort to seek "planarity".
My employer, by the way, is happy to quote product with any of the above
surface finishes.
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