I am interested in actual soldering defect rates found "out there".
While visiting a main customer, I was shocked to hear that the number of
open circuits detected at "in-circuit testing" was running around 25 ppm.
Apparently this problem is due to insufficient solder during surface mount
assembly and is due to many different causes. This value of 25 ppm was
stated as "above average" but at the same time was considered "okay" due to
the complexity and large number of interconnects on the pcb's. I would like
to ask the following questions:

1)      Can anyone share their actual "solder open" defects rates and
provide           how they compare with the industry average? (I would
attempt to                 establish the distribution curve of responses and
publish later) Can you         include bare board finish (ie HASL, reflow
tin-lead, OSP etc...)?

2)      Is this considered normal???

3)      Is there a repair procedure recommended by IPC to repair these types
of         defects and is there a reference IPC document?

4)      How are the defect rates normalized based upon assembly complexity,
board size and SMD pad geometries?

5)      Has this defect rate been "self-inflicted" with the advent of
no-clean          fluxes and solder paste?


Thanks

Dave Rooke - Circo Craft 
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