Karl:
               You hit the nail on the head about the non-necessity of
          thermal reliefs on small hole (,.015" dia.) vias.  HADCO as
          well as many other shops employ a post-oxide dip for the
          elimination of pink ring.  Even so, pink ring was probably
          not a real quality issue anyway.  IPC-RB-276 defines pink
          ring in section 3.2.2: "A zone around a through
          hole/internal layer interface from which the oxide coating
          on the copper has been discolored or chemically removed."
          It goes on to state  in section 3.6.2.3: "No evidence exists
          that pink ring affects functionality.  The presence of
          excessive pink ring may be considered an indicator of
          process or design variation but is not a cause for
          rejection.  The focus of concern should be the quality of
          the lamination bond."  If not adding thermal reliefs on
          small hole vias makes life easier for you, I say go ahead
          and do it.  From a bareboard standpoint, you will not be
          compromising anything.
          Tom Coyle
          Field Services Engineer
          HADCO Corporation
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          "The views represented above ARE those of my employer."