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| Date: | Thu, 14 Sep 1995 10:49:36 -0400 |
| Content-Type: | text/plain |
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Karl,
Thermal releifs on plated through holes, in general, are required when
attempting to solder a component lead in a hole that is connected to a large
copper area (ie. plane). If you are not soldering something into a hole, such
as noraml interconnect vias, thermal relief is not necessary. If you are
attempting to solder fill a vias for test purposes, then you may have to
continue thermal relieving.
Regards,
Gary Ferrari
Tech Circuits
203 269-3311
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