Regarding methods to separate V-scored boards from a panel, we are 
     investigating a machine called Maestro Separator made by C.A.B. 
     (Electronic Precision Technology, Newton, MA, (617)928-3400) that uses 
     2 opposed rollers with wedge shaped edges. The roller edges roll 
     through the V-grooves and break the connecting material. No bending 
     stress is applied to the board to disturb solder joints, so proximity 
     of part to edge can be minimized.
     We have not tested the machine yet, but I really like the concept.
     
     Allen Ahlert
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______________________________ Reply Separator _________________________________
Subject: Scoremarks and break-out lugs
Author:  [log in to unmask] at halsic_ccsmtp
Date:    4/28/95 10:15 AM


Hi there,
     
Yes, you guessed it - Friday afternoon is my email time - what better way 
to relax before the hectic weekend ahead !.. 
     
I am looking for some info. about board scoring and in particular 
proximity of components to scoremarks.  I understand the problems .. 
mechanical stressing of solder joints etc. .. but wanted to find out what 
spacing people are using out there.
     
I guess that there should be different spacings dependant on : 
-  component package (1206, SOT-23, SOIC etc.)
-  Breaking method (by hand, guillotine, breaking fixture etc.) 
-  Score depth etc.
     
I'd also be interested in feedback from those who use break out lugs on 
their panels.
     
Is anybody willing to share their experiences with the forum? 
I'd appreciate any references  to relevant literature also.
     
Thanks in advance..
     
     
Brendan McCormack
Senior Interconnect Engineer
AMT Ireland
Electronics Manufacturing Centre
University of Limerick
Limerick
Ireland
     
Ph. +353 61 331588
Fx. +353 61 330316
EM. [log in to unmask]