Regarding methods to separate V-scored boards from a panel, we are investigating a machine called Maestro Separator made by C.A.B. (Electronic Precision Technology, Newton, MA, (617)928-3400) that uses 2 opposed rollers with wedge shaped edges. The roller edges roll through the V-grooves and break the connecting material. No bending stress is applied to the board to disturb solder joints, so proximity of part to edge can be minimized. We have not tested the machine yet, but I really like the concept. Allen Ahlert [log in to unmask] ______________________________ Reply Separator _________________________________ Subject: Scoremarks and break-out lugs Author: [log in to unmask] at halsic_ccsmtp Date: 4/28/95 10:15 AM Hi there, Yes, you guessed it - Friday afternoon is my email time - what better way to relax before the hectic weekend ahead !.. I am looking for some info. about board scoring and in particular proximity of components to scoremarks. I understand the problems .. mechanical stressing of solder joints etc. .. but wanted to find out what spacing people are using out there. I guess that there should be different spacings dependant on : - component package (1206, SOT-23, SOIC etc.) - Breaking method (by hand, guillotine, breaking fixture etc.) - Score depth etc. I'd also be interested in feedback from those who use break out lugs on their panels. Is anybody willing to share their experiences with the forum? I'd appreciate any references to relevant literature also. Thanks in advance.. Brendan McCormack Senior Interconnect Engineer AMT Ireland Electronics Manufacturing Centre University of Limerick Limerick Ireland Ph. +353 61 331588 Fx. +353 61 330316 EM. [log in to unmask]