With regard to the question of flux compatibility to OSP finishes, it seems
that a major concern / misunderstanding in the industry is that no clean
pastes and fluxes will not solder well to OSP finished pads.

We have tested and documented the compatibility of several water clean and no
clean materials to both OSP and LPISM surface finishes.

Testing criteria conformed to IPC-SM-840B, Ansi/J-STD-001, MIL-P-28809A and
Martin Marietta Quality Specs.

These documents are readily available through Enthone-OMI Inc.

I hope the above is not considered too commercial.  The intent is to provide
the forum with information regarding OSP solderability with various flux type
materials.

Happy Holidays!

Tom Eshelman, Enthone-OMI
1.800.548.9801 ext. 7257
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