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| Date: | Thu, 14 Sep 1995 06:27:57 EDT |
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-- [ From: Doug Jeffery * EMC.Ver #2.10P ] --
On 9/8/95 Karl Sauter Wrote:
>Does there remain any reason to have thermal reliefs on vias (ie:
drilled hole size less than 0.016" diameter) ?
Karl,
We see between 10 and 30 new designs a week come in and I estimate that
30 to 40% of those do not have thermal relief on the via sizes. This
design is being used by my customers and I have not hear any negative
feed back.
I have not seen this used on technologies using more than 2 power and
ground planes, although I don't know why it would not apply there also.
Doug Jeffery
Electrotek
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