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1995

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Subject:
From:
BOB HOENE <[log in to unmask]>
Date:
Fri, 13 Oct 1995 09:56:07 -0600
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TEXT/PLAIN (12 lines)
Has anyone ever seen or heard of a product for adapting from an SOIC
footprint to a DIP package? We have an opportunity to go from a 20 pin
SOIC Wide body to a standard 20 pin DIP package. Allocation you know.

Thanks,

Bob Hoene
Marquette Electronics
Milwaukee, WI



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