Brendan,

I use the following for breakout:

four 0.036 nonplated holes 0.050 center to center,   0.016 in from board edge.

I use a 0.093 route.  stop the center of the route 0.022 from the center
                      of the 0.036 hole.

----                  ----------
    \                /
____/                \_________  board edge
       #  #  #  #   4 holes 0.016 in from board edge
   |   |
   |   |
---|   |---- 0.022


---------------------------
John Laur
Allen-Bradley, Inc.                 
1201 South Second Street
Milwaukee, WI 53204
FAX:  	(414) 382-2162
PHONE:	(414) 382-2393

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	From [log in to unmask] Fri Apr 28 13:43:20 1995
	Resent-Date: Fri, 28 Apr 1995 16:37:11 +0100 (WET DST)
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	From: brendan mccormack <[log in to unmask]>
	Subject: Scoremarks and break-out lugs
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	Hi there,
	
	Yes, you guessed it - Friday afternoon is my email time - what better way
	to relax before the hectic weekend ahead !.. 
	
	I am looking for some info. about board scoring and in particular
	proximity of components to scoremarks.  I understand the problems ..
	mechanical stressing of solder joints etc. .. but wanted to find out what
	spacing people are using out there.
	
	I guess that there should be different spacings dependant on :
	-  component package (1206, SOT-23, SOIC etc.)
	-  Breaking method (by hand, guillotine, breaking fixture etc.)
	-  Score depth etc.
	
	I'd also be interested in feedback from those who use break out lugs on
	their panels.
	
	Is anybody willing to share their experiences with the forum? 
	I'd appreciate any references  to relevant literature also.
	
	Thanks in advance..
	
	
	Brendan McCormack
	Senior Interconnect Engineer
	AMT Ireland
	Electronics Manufacturing Centre
	University of Limerick
	Limerick
	Ireland
	
	Ph. +353 61 331588
	Fx. +353 61 330316
	EM. [log in to unmask]