Hi,
 
 Is there anyone can answer my question ? 

 What's the optimal baking condition for ML board before IR reflow ?

 Before you answering, I should let you know what are the boards as below;  

   1.Some vacuum-package of ML boards had been destroyed,
     before the boards baking.

   2. The shipping date of some boards are more than 7 monthes ago.
  

 Please give me your recommendation on the time/temperature/stack control.
  
Thanks in advance

__                                                                       __
__  Irving Lee          - PacRim PWB Qualification Office   - TAO/1BBF   __
__  E-mail:  TAENG::IRVINGLEE ([log in to unmask])             __
__  Phone:  +886-3-3900000 Ext:2164   Fax:   +886-3-3908533              __





From:	TAENG::US3RMC::"[log in to unmask]" "MAIL-11 Daemon" 16-NOV-1995 00:43:01.62
To:	[log in to unmask]
CC:	
Subj:	Delamination

HI
1.-As european PCB fabricator I am looking for IPC spec. about baking ML
boards before IR reflow to prevent delamination. 
In my experience this prebaking is necessari because uncontroled humidity
absortion. We feel that whit > 0,1% humidity absorved, there is potential
risk of delamination even in a standard parameters of IR reflowing.

2.- I am looking too for IPC standards in CD-ROM format.

Any information will be apreciated.

Jose Muelas LAB CIRCUITS S.A. (Spain)


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